Insulins Compatible with New Generation Implantable Pumps

    公开(公告)号:US20210330751A1

    公开(公告)日:2021-10-28

    申请号:US17368432

    申请日:2021-07-06

    摘要: A closed device for introducing preservative-free insulin into the intraperitoneal space is presented. In embodiments, the closed device includes an insulin reservoir configured to store preservative-free insulin, a pump connected to the reservoir, and an antimicrobial inlet filter connected to an inlet of the reservoir or provided in an inlet flow path in fluid communication with the reservoir. The device is configured to be disposed in the intraperitoneal space of a body, and to discharge preservative-free insulin into a peritoneal space of the body. In some embodiments, the device includes a second antimicrobial filter, provided at an outlet of the reservoir. In some embodiments, the device further includes a header in fluid communication with the outlet path, and a third antimicrobial filter, provided in the header.

    Attachment Method for Microfluidic Device
    4.
    发明公开

    公开(公告)号:US20230364604A1

    公开(公告)日:2023-11-16

    申请号:US18105936

    申请日:2023-02-06

    发明人: Peter C. Lord

    摘要: In embodiments, a silicon part and a titanium part may be soldered together without breakage or instability. In embodiments, silicon and titanium may be soldered together with a soft solder joint including indium silver, where the temperature excursion between solder solidus and use temperature limits the strain between the two surfaces. In embodiments a silicon micropump surface may be treated to remove its silicon oxide coating, and then Ti—W, Nickel, and gold layers successively sputtered onto it. A corresponding titanium manifold may be ground flat, and plated with electroless nickel. The nickel plated manifold may then be baked, so as to create a transition from pure Ti to Ni—Ti alloy to pure Ni at the surface of the manifold, and for protection of the upper Ni surface, a layer of gold may be added. The two surfaces may then be soldered in forming gas.

    Attachment method for microfluidic device

    公开(公告)号:US11571692B2

    公开(公告)日:2023-02-07

    申请号:US16017694

    申请日:2018-06-25

    发明人: Peter C. Lord

    摘要: A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.