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公开(公告)号:US20180193426A1
公开(公告)日:2018-07-12
申请号:US15808814
申请日:2017-11-09
发明人: Peter C. Lord , William Van Antwerp
CPC分类号: A61K38/28 , A61K9/0019 , A61M5/14276 , A61M31/002 , A61M2025/0057 , A61M2205/0294 , A61M2205/3344 , A61M2205/368 , A61M2205/7581 , A61M2210/1017
摘要: Exemplary embodiments of the present invention are directed to stabilized insulin compositions suitable for use in implantable artificial pancreatic devices. In embodiments, purified insulin may be made more stable by introducing an insulin analog that will form a heterodimer with the purified insulin. For example, a quantity of between ½ to 10% of one of A21 desamido insulin or Lispro may be added to a purified insulin preparation, resulting in a more stable insulin. Various other methods and preparations of stable insulins, and various catheters for delivering insulins from an implantable device to a body are also presented.
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公开(公告)号:US20240008768A1
公开(公告)日:2024-01-11
申请号:US18035778
申请日:2021-11-08
发明人: Peter C. Lord , Donald M. Cohen , Pedrum Minaie
CPC分类号: A61B5/14503 , A61B5/14532 , A61B5/4839 , A61M25/007 , A61M25/0045 , A61M2025/0073
摘要: An implantable catheter for medication delivery and analyte sensing is provided. In embodiments, a permanent catheter portion for use in an implanted delivery device, includes a permanent tube with an inner lumen, a sleeve attached to the permanent tube, the sleeve having outer coating that is at least one of: non-inflammatory or preventative of foreign body response. The permanent tube further includes an opening to receive a distal catheter portion that extends into the sleeve, such that the inner lumen of the permanent tube is fluidly connected to a distal inner lumen of the distal catheter portion.
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公开(公告)号:US20210330751A1
公开(公告)日:2021-10-28
申请号:US17368432
申请日:2021-07-06
发明人: Peter C. Lord , William Van Antwerp
摘要: A closed device for introducing preservative-free insulin into the intraperitoneal space is presented. In embodiments, the closed device includes an insulin reservoir configured to store preservative-free insulin, a pump connected to the reservoir, and an antimicrobial inlet filter connected to an inlet of the reservoir or provided in an inlet flow path in fluid communication with the reservoir. The device is configured to be disposed in the intraperitoneal space of a body, and to discharge preservative-free insulin into a peritoneal space of the body. In some embodiments, the device includes a second antimicrobial filter, provided at an outlet of the reservoir. In some embodiments, the device further includes a header in fluid communication with the outlet path, and a third antimicrobial filter, provided in the header.
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公开(公告)号:US20230364604A1
公开(公告)日:2023-11-16
申请号:US18105936
申请日:2023-02-06
发明人: Peter C. Lord
CPC分类号: B01L3/502707 , F04B43/043 , B01L3/502715 , B81C3/001 , A61M5/14276 , B81C2201/0181 , A61M2205/0244 , B01L2400/0487
摘要: In embodiments, a silicon part and a titanium part may be soldered together without breakage or instability. In embodiments, silicon and titanium may be soldered together with a soft solder joint including indium silver, where the temperature excursion between solder solidus and use temperature limits the strain between the two surfaces. In embodiments a silicon micropump surface may be treated to remove its silicon oxide coating, and then Ti—W, Nickel, and gold layers successively sputtered onto it. A corresponding titanium manifold may be ground flat, and plated with electroless nickel. The nickel plated manifold may then be baked, so as to create a transition from pure Ti to Ni—Ti alloy to pure Ni at the surface of the manifold, and for protection of the upper Ni surface, a layer of gold may be added. The two surfaces may then be soldered in forming gas.
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公开(公告)号:US11571692B2
公开(公告)日:2023-02-07
申请号:US16017694
申请日:2018-06-25
发明人: Peter C. Lord
摘要: A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.
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