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    METHOD OF CUTTING A SUBSTRATE AND A DEVICE FOR CUTTING
    3.
    发明申请
    METHOD OF CUTTING A SUBSTRATE AND A DEVICE FOR CUTTING 审中-公开
    切割基板和切割装置的方法

    公开(公告)号：US20120181264A1

    公开(公告)日：2012-07-19

    申请号：US13498349

    申请日：2010-09-29

    申请人： Enrico Stura ,  Christian Schmidt ,  Michael Linder

    发明人： Enrico Stura ,  Christian Schmidt ,  Michael Linder

    IPC分类号： H05B7/18

    CPC分类号： B23K9/013

    摘要： The present invention relates to a method of cutting a substrate by the introduction of thermo-mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting method specified. The present invention also relates to a device for performing the method according to the present invention.

    摘要翻译： 本发明涉及通过引入热机械张力来切割基板的方法。 本发明还涉及通过规定的切割方法精确地制造衬底形状。 本发明还涉及一种用于执行根据本发明的方法的装置。

    METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE
    4.
    发明申请
    METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE 审中-公开
    通过基板生产电导体的方法

    公开(公告)号：US20120138339A1

    公开(公告)日：2012-06-07

    申请号：US13390158

    申请日：2010-08-04

    申请人： Leander Dittmann

    发明人： Leander Dittmann

    IPC分类号： H05K1/00 ,  H01K3/10

    CPC分类号： B26F1/28 ,  H05K3/0017 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/105 ,  H05K3/4038 ,  H05K2201/0323 ,  H05K2203/105 ,  H05K2203/1115 ,  H05K2203/1136 ,  Y10T29/49165

    摘要： The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3′), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.

    摘要翻译： 本发明涉及一种在衬底中制造导电通孔的方法及其制造的衬底。 该方法包括以下步骤：a）提供由至少一个电绝缘材料（1）制成的衬底，b）将所述衬底放置在两个电极（3,3'）之间，所述两个电极连接到用户控制的电压源 （4），c）向所述衬底施加电压，d）通过局部地或全面地增加所述衬底的导电性，在所述两个电极之间通过所述衬底造成电介质击穿和能量耗散，其中在步骤d）中， 所述至少一个电绝缘材料变成导电材料，从而产生导电通孔（6）。 特别地，在一个实施例中，本发明涉及一种基板，例如具有一个或多个无金属导电通孔的印刷电路板。

    Electrothermal focussing for the production of micro-structured substrates
    7.
    发明授权
    Electrothermal focussing for the production of micro-structured substrates 有权
    电热聚焦用于生产微结构衬底

    公开(公告)号：US08389903B2

    公开(公告)日：2013-03-05

    申请号：US12741734

    申请日：2008-11-07

    申请人： Christian Schmidt

    发明人： Christian Schmidt

    IPC分类号： B26F1/28

    CPC分类号： B26F1/28

    摘要： The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequently, a dissipation of said stored electrical energy within the substrate and d) dissipating said stored electrical energy, wherein the rate of dissipating said stored electrical energy is controlled by a current and power modulating element, said current and power modulating element being part of the electrical connection between said energy storage element and said substrate. A device for performing the method is also provided.

    摘要翻译： 本发明涉及用于生产微结构基底的方法和装置及其在自然科学和技术中的应用，特别是在微流体和分析装置中，并且提供了一种引入结构，优选为空穴或空腔或通道或孔的方法， 所述方法包括以下步骤：a）提供电绝缘衬底; b）使用能量存储元件（c）将电能存储在所述衬底上，所述能量存储元件（c）被充电 利用所述电能，所述能量存储元件电连接到所述衬底，所述电能足以显着加热和/或熔化和/或蒸发所述衬底的部分或全部区域，c）施加额外的能量，优选地 加热到所述衬底或其区域以增加所述衬底或其所述区域的导电性，从而引发弯曲 并且随后消耗所述存储的电能在衬底内，以及d）耗散所述存储的电能，其中所述存储的电能的耗散速率由电流和功率调制元件控制，所述电流和功率调制元件 是所述能量存储元件和所述衬底之间的电连接的一部分。 还提供了一种用于执行该方法的装置。

    Manufacturing and use of microperforated substrates
    8.
    发明授权
    Manufacturing and use of microperforated substrates 有权
    微孔基材的制造和使用

    公开(公告)号：US08759707B2

    公开(公告)日：2014-06-24

    申请号：US10594991

    申请日：2005-03-30

    申请人： Christian Schmidt

    发明人： Christian Schmidt

    IPC分类号： B23H1/02

    CPC分类号： B26D7/10 ,  B26F1/28

    摘要： This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.

    摘要翻译： 本发明涉及用于生产微结构底物的方法和装置及其在自然科学和技术中的应用，特别是在基于人造和生物脂质膜的分析和检测系统中。 该结构优选是孔或空腔或通道，并且通过火花穿孔获得。 能量，优选热量被施加到待构造的区域，以便减小所需的电压的幅度和/或软化材料。 火花穿孔的电气参数是反馈控制的。