公开(公告)号：US20120211265A1

公开(公告)日：2012-08-23

申请号：US13458167

申请日：2012-04-27

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/02

CPC分类号： H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads.

摘要翻译： 本发明提供一种电子组件。 组件不使用焊料。 具有I / O引线的组件或组件封装安装在柔性基板上，并用电绝缘材料封装。 通孔通过基板连接到组件的引线。

公开(公告)号：US20120006589A1

公开(公告)日：2012-01-12

申请号：US13185323

申请日：2011-07-18

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/16

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/185 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/041 ,  H05K2201/10318 ,  H05K2203/065 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

摘要翻译： 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。

公开(公告)号：US20110199740A1

公开(公告)日：2011-08-18

申请号：US13094105

申请日：2011-04-26

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

摘要翻译： 一种用于制造单片模制电子组件（12）的方法（10）。 提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。 模具具有连接到腔室中的注射口（22）和通道（24）。 具有电子触点（32）的电子部件（30）填充到第二模具部分上，以基本上容纳在腔室中。 将模具配合在一起，并且通过注入口通道注入液体绝缘模塑材料（36）以填充腔室。 将成型材料硬化成固体，从而将电子部件嵌入到成型材料中作为整体式子组件（40）。 将单片子组件从模具中取出，并且将一个或多个无焊导电电路（50）施加到电子部件的电子触点，从而提供电子组件。

公开(公告)号：US20090041977A1

公开(公告)日：2009-02-12

申请号：US12187323

申请日：2008-08-06

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： B32B3/24 ,  B32B37/00 ,  B32B43/00 ,  B32B3/02

CPC分类号： H05K1/185 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4664 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T428/24273 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electronic assembly 400 and a machine 800 for its manufacture. The assembly 400 has no solder. Components 406, or component packages 402, with I/O leads 412 sit on a planar substrate. The machine 800 encapsulates the components 406 or component packages, with electrically insulating material with vias 420 extending through the substrate to the components' leads 412. Then the machine 800 plates the components' leads and forms traces. Next, the machine 800 covers the plated material with electrically insulating material. Additional vias may extend through the material covering the plated material and in turn be plated and covered. The machine 800 repeats the formation of vias, plating, and coverings of the assembly as desired.

摘要翻译： 本发明提供一种用于其制造的电子组件400和机器800。 组件400没有焊料。 具有I / O引线412的部件406或部件封装件402位于平面基板上。 机器800封装组件406或组件封装，其中电绝缘材料与通孔420延伸穿过衬底到组件引线412.然后机器800压平部件引线并形成迹线。 接下来，机器800用电绝缘材料覆盖电镀材料。 附加的通孔可以延伸穿过覆盖电镀材料的材料，并且进而被电镀和覆盖。 机器800根据需要重复组装过孔，电镀和覆盖物的形成。

公开(公告)号：US20080297985A1

公开(公告)日：2008-12-04

申请号：US12191544

申请日：2008-08-14

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01R43/00 ,  H02B1/00

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/185 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/041 ,  H05K2201/10318 ,  H05K2203/065 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

摘要翻译： 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。

公开(公告)号：US08404977B2

公开(公告)日：2013-03-26

申请号：US13458167

申请日：2012-04-27

申请人： Joseph C Fjelstad

发明人： Joseph C Fjelstad

IPC分类号： H05K1/02 ,  H05K1/00

CPC分类号： H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a flexible electronic assembly that uses no solder. Components or component packages are mounted on a flexible substrate. Vias connect through the substrate to the components' leads. Circuits are formed on the opposite side of the substrate interconnecting the component through the vias. The assembly is made flexible by removing encapsulent material between components.

摘要翻译： 提供了不使用焊料的柔性电子组件。 组件或组件封装安装在柔性基板上。 通孔通过基板连接到组件的引线。 电路形成在衬底的相反侧，该衬底通过过孔互连组件。 通过在组件之间移除密封材料，使组件变得柔性。

公开(公告)号：US20090277677A1

公开(公告)日：2009-11-12

申请号：US12429988

申请日：2009-04-24

申请人： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

发明人： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

IPC分类号： H05K1/18 ,  H05K13/00

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K3/1241 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/0173 ,  H05K2203/1469 ,  Y10T29/49117

摘要： A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.

摘要翻译： 用于原型电路的系统，以及创建生产电路，而不使用焊料。 待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中 。 元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。 迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

公开(公告)号：US20090237901A1

公开(公告)日：2009-09-24

申请号：US12405773

申请日：2009-03-17

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/18 ,  B29C45/14

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

摘要翻译： 一种用于制造单片模制电子组件（12）的方法（10）。 提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。 模具具有连接到腔室中的注射口（22）和通道（24）。 具有电子触点（32）的电子部件（30）填充到第二模具部分上，以基本上容纳在腔室中。 将模具配合在一起，并且通过注入口通道注入液体绝缘模塑材料（36）以填充腔室。 将成型材料硬化成固体，从而将电子部件嵌入到成型材料中作为整体式子组件（40）。 将单片子组件从模具中取出，并且将一个或多个无焊导电电路（50）施加到电子部件的电子触点，从而提供电子组件。

公开(公告)号：US20090056997A1

公开(公告)日：2009-03-05

申请号：US12200749

申请日：2008-08-28

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01R12/04 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/92144 ,  H01L2224/96 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/2018 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49146 ,  H01L2924/00

摘要： A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

摘要翻译： 包含孔102,103,104的框架100定位在永久基板206a或临时基板206b上并连接到永久基板206a或临时基板206b上。 电气部件202,203,204被放置在相应的孔102,103,104中，其中部件202,203,204的引线504,1002定位在永久性基板206a上并连接到永久基板206a或 临时衬底206b。 然后，电绝缘但优选导热的密封剂402包封部件102,103,104。在这一点上，可以移除暴露部件引线1002的临时基板206b。或者，如果部件102,103 ，104安装在永久性基板206a上，通孔502从基板206a的表面延伸到引线504.在引线504,1002露出的情况下，完成的子组件500,1000可以并入各种形式的反向互连工艺（RIP）组件 具体如相关申请。

公开(公告)号：US20110182042A1

公开(公告)日：2011-07-28

申请号：US13081384

申请日：2011-04-06

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/09 ,  H05K1/00

CPC分类号： H05K1/189 ,  B32B37/12 ,  B32B2307/202 ,  B32B2457/08 ,  H01L2224/48465 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10719 ,  H05K2203/0156 ,  H05K2203/0173 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

摘要翻译： 电子组件400及其制造方法800,900,1000 1200,1400,1500,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 然后组件被镀覆1200，并且重复包封和钻孔工艺1500以建立所需层422,1502,1702。平面基板808可以是柔性基板2016，允许组件2000弯曲到 适合各种外壳。