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公开(公告)号:US4672417A
公开(公告)日:1987-06-09
申请号:US631634
申请日:1984-07-17
Applicant: Susumu Sugiyama , Yoshio Nakamura , Harunobu Ohno , Tokimasa Kamiya
Inventor: Susumu Sugiyama , Yoshio Nakamura , Harunobu Ohno , Tokimasa Kamiya
IPC: H01L23/48 , H01L23/047 , H01L23/373 , H01L23/66 , H01L25/04 , H01L23/50 , H01L23/06 , H01L29/44
CPC classification number: H01L23/047 , H01L23/3731 , H01L23/66 , H01L24/49 , H01L2223/6611 , H01L2223/6644 , H01L2224/32188 , H01L2224/45014 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/351
Abstract: In a 3-terminal package sealed semiconductor device such as a transistor or a thyristor, an insulator formed between the respective lead conductors is made of alumina ceramic. An electrode conductor base (one of the lead conductors) for mounting a semiconductor device thereon is made of a copper-tungsten sintered alloy containing 2% by volume to 48% by volume of copper. The thermal expansion coefficient of the insulator becomes substantially the same as that of the electrode conductor base, thereby elmininating a conventionally used intermediate damping member and hence providing a compact semiconductor apparatus which has a high packaging density and which can switch a large current at high speed. The respective lead conductors have predetermined sizes to achieve high-speed large-current switching.
Abstract translation: 在诸如晶体管或晶闸管的三端封装半导体器件中,形成在各引线之间的绝缘体由氧化铝陶瓷制成。 用于在其上安装半导体器件的电极导体基座(一个引线导体)由含有2体积%至48体积%的铜的铜 - 钨烧结合金制成。 绝缘体的热膨胀系数与电极导体基体的热膨胀系数基本相同,从而消除了常规使用的中间阻尼构件,因此提供了具有高封装密度且可高速切换大电流的紧凑型半导体装置 。 各引线导体具有预定尺寸以实现高速大电流切换。