High Frequency And High Power Thin-Film Component

    公开(公告)号:US20240250113A1

    公开(公告)日:2024-07-25

    申请号:US18609003

    申请日:2024-03-19

    摘要: A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm2 at about 28 GHz.

    Multilayer ceramic capacitor having ultra-broadband performance

    公开(公告)号:US11984262B2

    公开(公告)日:2024-05-14

    申请号:US17680746

    申请日:2022-02-25

    IPC分类号: H01G4/012 H01G4/30

    CPC分类号: H01G4/012 H01G4/30

    摘要: A multilayer ceramic capacitor may include a monolithic body including a plurality of dielectric layers and a plurality of electrode regions. The plurality of electrode regions can include a dielectric region, an active electrode region, and a shield electrode region. The active electrode region may be located between the dielectric region and the shield electrode region in a Z-direction. The dielectric region may extend from the active electrode region to the top surface of the broadband multilayer ceramic capacitor. The capacitor may include a plurality of active electrodes arranged within the active electrode region and at least one shield electrode arranged within the shield electrode region. The dielectric region may be free of electrode layers that extend greater than 25% of a length of the capacitor. A ratio of a capacitor thickness to a thickness of the dielectric region may be less than about 20.

    Multilayer Capacitor
    5.
    发明公开

    公开(公告)号:US20240145169A1

    公开(公告)日:2024-05-02

    申请号:US18494797

    申请日:2023-10-26

    发明人: Marianne Berolini

    IPC分类号: H01G4/012 H01G4/232 H01G4/30

    摘要: The present invention is directed to a multilayer capacitor, a circuit board containing the multilayer capacitor, and an integrated circuit package containing the multilayer capacitor. A multilayer capacitor includes a body containing alternating dielectric layers and internal electrode layers that each include a first electrode and a second, co-planar electrode, the first electrode having a main body with at least one lead tab extending from each of a top edge and a bottom edge thereof. The capacitor also includes a first external terminal and a second external terminal that each wrap from a top surface, along an end surface, to a bottom surface. The first external terminal is electrically connected to the first electrode of the first internal electrode layers along its lead tab leading edges, and the second external terminal is electrically connected to the first electrode of the second internal electrode layers along its lead tab leading edges.

    High frequency and high power thin-film component

    公开(公告)号:US11949169B2

    公开(公告)日:2024-04-02

    申请号:US17676889

    申请日:2022-02-22

    摘要: A resistive splitter can include a monolithic substrate and a patterned resistive layer formed over the monolithic substrate. The resistive splitter can include a first terminal, a second terminal, and a third terminal each connected with the patterned resistive layer. The resistive splitter can include at least one frequency compensating conductive layer formed over a portion of the patterned resistive layer. In some embodiments, the resistive splitter can exhibit a first insertion loss response between the first terminal and the second terminal that is greater than about −10 dB for frequencies ranging from about 0 GHz up to about 30 GHz.

    Solid electrolytic capacitor
    7.
    发明授权

    公开(公告)号:US11915886B2

    公开(公告)日:2024-02-27

    申请号:US17603074

    申请日:2020-04-22

    申请人: ROHM CO., LTD.

    发明人: Toshiyuki Nagai

    摘要: A solid electrolytic capacitor includes: a porous sintered body made of a valve metal; an anode wire that has a portion extending inside the porous sintered body, and that protrudes from the porous sintered body; a dielectric layer formed on the porous sintered body; a solid electrolyte layer formed on the dielectric layer; a cathode layer formed on the solid electrolyte layer; and a protective film having at least a portion formed on the cathode layer. The protective film has a glass transition point of 180° C. or lower.

    Low Inductance Component
    10.
    发明公开

    公开(公告)号:US20230238186A1

    公开(公告)日:2023-07-27

    申请号:US18194675

    申请日:2023-04-03

    摘要: A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.