公开(公告)号：US11692702B2

公开(公告)日：2023-07-04

申请号：US17673001

申请日：2022-02-16

申请人： Paul Palfreyman ,  Philippe M. Schick ,  Michael A. Tischler

发明人： Paul Palfreyman ,  Philippe M. Schick ,  Michael A. Tischler

IPC分类号： F21V33/00 ,  E04B1/84 ,  F21S8/04 ,  F21Y105/16 ,  F21Y115/10

CPC分类号： F21V33/0056 ,  E04B1/8409 ,  F21S8/04 ,  F21Y2105/16 ,  F21Y2115/10

摘要： In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.

公开(公告)号：US10319890B2

公开(公告)日：2019-06-11

申请号：US15006242

申请日：2016-01-26

申请人： Michael A. Tischler ,  Alborz Amini

发明人： Michael A. Tischler ,  Alborz Amini

IPC分类号： H01L21/67 ,  H01L33/62 ,  H01L23/00

摘要： In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.

公开(公告)号：US10260126B2

公开(公告)日：2019-04-16

申请号：US15005396

申请日：2016-01-25

申请人： Michael A. Tischler ,  Calvin Wade Sheen

发明人： Michael A. Tischler ,  Calvin Wade Sheen

IPC分类号： H05K3/04 ,  C22B7/00 ,  H05K13/04 ,  H05K1/18

摘要： In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.

公开(公告)号：US10253934B2

公开(公告)日：2019-04-09

申请号：US15196830

申请日：2016-06-29

申请人： Michael A. Tischler ,  Paul Palfreyman

发明人： Michael A. Tischler ,  Paul Palfreyman

IPC分类号： F21S2/00 ,  F21V23/06 ,  F21V21/005 ,  F21V21/14 ,  H01S5/042 ,  H05B33/08 ,  H05B37/02 ,  G09F13/00 ,  F21V19/00 ,  F21V23/02 ,  F21V17/10 ,  F21V17/16 ,  F21V21/35 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y105/00

摘要： In accordance with various embodiments, a modular lighting system features multiple light panels each having multiple light-emitting elements thereon, as well as connectors for electrically and mechanically interconnecting the light panels.

公开(公告)号：US10037947B1

公开(公告)日：2018-07-31

申请号：US15495014

申请日：2017-04-24

申请人： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

发明人： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L23/538 ,  H01L33/50 ,  H01L23/14

CPC分类号： H01L23/5387 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041

摘要： In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US09797561B2

公开(公告)日：2017-10-24

申请号：US15349447

申请日：2016-11-11

申请人： Paul Palfreyman ,  Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth

发明人： Paul Palfreyman ,  Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth

IPC分类号： H05B39/00 ,  F21S4/22 ,  H05B33/08 ,  F21V21/14 ,  F21S2/00 ,  H05K1/00 ,  F21V23/02 ,  F21V23/06 ,  F21V21/005 ,  F21V23/00 ,  F21Y101/00 ,  F21Y105/12 ,  F21Y105/10 ,  F21Y115/10

CPC分类号： F21S4/22 ,  F21S2/00 ,  F21V21/005 ,  F21V21/14 ,  F21V23/003 ,  F21V23/005 ,  F21V23/02 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05B33/08 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/0827 ,  H05B33/0845 ,  H05K1/00 ,  H01L2924/00

摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.

公开(公告)号：US09696019B2

公开(公告)日：2017-07-04

申请号：US14711891

申请日：2015-05-14

申请人： Paul Palfreyman ,  Philippe Schick ,  Michael A. Tischler

发明人： Paul Palfreyman ,  Philippe Schick ,  Michael A. Tischler

IPC分类号： F21V21/14 ,  F21V23/06 ,  G09F13/00 ,  G09F13/22 ,  F21V33/00 ,  F21L4/00 ,  G06F1/16 ,  F21V31/00 ,  F21L4/08 ,  F21V17/00 ,  F21V21/08 ,  F21K9/20 ,  F21Y105/10 ,  F21Y115/10

CPC分类号： F21V21/14 ,  F21K9/20 ,  F21L4/00 ,  F21L4/08 ,  F21V17/007 ,  F21V21/08 ,  F21V23/06 ,  F21V31/005 ,  F21V33/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G06F1/1616 ,  G09F13/00 ,  G09F13/22 ,  G09F2013/222

摘要： In accordance with various embodiments, planar light sheets are conformed to interior volumes of housings to produce predetermined spatial optical characteristics such as luminous intensity distributions.

公开(公告)号：US09647188B2

公开(公告)日：2017-05-09

申请号：US14952294

申请日：2015-11-25

申请人： Michael A. Tischler

发明人： Michael A. Tischler

IPC分类号： H01L21/00 ,  H01L33/62 ,  H01L21/78 ,  H01L33/50 ,  H01L23/00 ,  H01L23/544 ,  H01L25/065 ,  H01L21/683 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/505 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32227 ,  H01L2224/73104 ,  H01L2224/80001 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01014

摘要： In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.

公开(公告)号：US09526132B2

公开(公告)日：2016-12-20

申请号：US14499887

申请日：2014-09-29

申请人： Paul Palfreyman ,  Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth

发明人： Paul Palfreyman ,  Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth

IPC分类号： H05B39/00 ,  H05B33/08 ,  F21V21/14 ,  F21S2/00 ,  H05K1/00 ,  F21V21/005 ,  F21V23/00 ,  F21Y101/00

CPC分类号： F21S4/22 ,  F21S2/00 ,  F21V21/005 ,  F21V21/14 ,  F21V23/003 ,  F21V23/005 ,  F21V23/02 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05B33/08 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/0827 ,  H05B33/0845 ,  H05K1/00 ,  H01L2924/00

摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.

公开(公告)号：US09520783B2

公开(公告)日：2016-12-13

申请号：US14976770

申请日：2015-12-21

申请人： Michael A. Tischler ,  William P. Coetzee ,  Paul Jungwirth

发明人： Michael A. Tischler ,  William P. Coetzee ,  Paul Jungwirth

IPC分类号： H02M3/158 ,  H02M1/08 ,  H05B33/08 ,  H02M1/42 ,  H02M3/335 ,  H02M3/337 ,  H02M1/00

CPC分类号： H05B33/0815 ,  H02M1/08 ,  H02M1/4225 ,  H02M3/158 ,  H02M3/33515 ,  H02M3/337 ,  H02M2001/0009 ,  H02M2001/007 ,  H05B33/0812 ,  H05B33/0827 ,  H05B33/083 ,  H05B33/0845 ,  H05B33/0851 ,  Y02B70/126

摘要： In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.