公开(公告)号：US11769710B2

公开(公告)日：2023-09-26

申请号：US16833034

申请日：2020-03-27

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Ken Chang ,  Mayank Raj ,  Chuan Xie ,  Yohan Frans

IPC: H01L23/473 ,  H01L25/16 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L25/167 ,  H01L2023/4062

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.