公开(公告)号：US10862588B1

公开(公告)日：2020-12-08

申请号：US16448736

申请日：2019-06-21

Applicant: XILINX, INC.

Inventor： Chuan Xie

IPC: H04B10/27 ,  H04B10/516 ,  H04J14/02

Abstract: An apparatus and method for generating a dense wavelength division and multiplexing (DWDM) optical stream in a photonic integrated circuit (PIC) is disclosed. An optical input source including a number (N) of optical channels (wavelengths) may be separated (de-interleaved) into multiple optical streams, each including a corresponding subset of the optical channels of the optical input source. Each of the multiple split optical streams may be modulated with an associated set of data streams by silicon-based micro-ring modulators to generate a corresponding modulated optical stream. A first pair of the modulated optical streams may be combined (interleaved) to generate a first optical output stream including N/2 modulated optical channels, and a second pair of the modulated optical streams may be combined (interleaved) to generate a second optical output stream including N/2 modulated optical channels. The channel spacing of the first and second optical output streams may be twice the channel spacing of the optical input source.

公开(公告)号：US11005572B1

公开(公告)日：2021-05-11

申请号：US17093399

申请日：2020-11-09

Applicant: XILINX, INC.

Inventor： Ping Chuan Chiang ,  Mayank Raj ,  Chuan Xie ,  Stanley Y. Chen ,  Sandeep Kumar ,  Sukruth Pattanagiri ,  Parag Upadhyaya ,  Yohan Frans

IPC: H04B10/69 ,  H03L1/02 ,  H03L7/189

Abstract: Examples described herein generally relate to a temperature-locked loop for optical elements. In an example, a device includes a controller and a digital-to-analog converter (DAC). The controller includes a DC-controllable transimpedance stage (DCTS), a slicer circuit, and a processor. The DCTS is configured to be coupled to a photodiode. An input node of the slicer circuit is coupled to an output node of the DCTS. The processor has an input node coupled to an output node of the slicer circuit. The DAC has an input node coupled to an output node of the processor and is configured to be coupled to a heater. The processor is configured to control (i) the DCTS to reduce a DC component of a signal on the output node of the DCTS and (ii) an output voltage on the output node of the DAC, both based on a signal output by the slicer circuit.

公开(公告)号：US11769710B2

公开(公告)日：2023-09-26

申请号：US16833034

申请日：2020-03-27

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Ken Chang ,  Mayank Raj ,  Chuan Xie ,  Yohan Frans

IPC: H01L23/473 ,  H01L25/16 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L25/167 ,  H01L2023/4062

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

公开(公告)号：US12072239B1

公开(公告)日：2024-08-27

申请号：US18128948

申请日：2023-03-30

Applicant: XILINX, INC.

Inventor： Zhaowen Wang ,  Mayank Raj ,  Chuan Xie ,  Sandeep Kumar ,  Muqseed Mohammad ,  Sukruth Pattanagiri Giriyappa ,  Stanley Y. Chen ,  Parag Upadhyaya ,  Yohan Frans

IPC: G01J1/44 ,  G01J1/02 ,  H03F3/45

CPC classification number: G01J1/44 ,  G01J1/0252 ,  H03F3/45076 ,  G01J2001/444 ,  G01J2001/446

Abstract: An integrated circuit (IC) device includes a controller circuitry having an input coupled to a photodiode of an optoelectronic circuitry and an output coupled to a heater of the optoelectronic circuitry, the controller circuitry configured to determine a center frequency of the optoelectronic circuitry based on a shape of an input signal received from the photodiode, and provide a heater signal to the heater based on the shape of the input signal and the center frequency of the optoelectronic circuitry.

公开(公告)号：US20240329329A1

公开(公告)日：2024-10-03

申请号：US18129765

申请日：2023-03-31

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Chuan Xie ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Nagadeven Karunakaran ,  Ferdinand F. Fernandez

IPC: G02B6/38 ,  G02B6/42

CPC classification number: G02B6/3849 ,  G02B6/381 ,  G02B6/4295

Abstract: A method of fabricating a chip package is provided, and a chip package fabricated using the same are provided. The method includes connecting a photonic die to a substrate of the chip package and attaching a protection apparatus to the substrate. The method also includes attaching a photonic connector to the photonic die. At least a portion of the photonic connector is disposed inside a housing of the protection apparatus. A fabrication process is performed on the chip package while the photonic connector is inside the housing. After processing, the photonic connector is removed from the housing.

公开(公告)号：US11668874B1

公开(公告)日：2023-06-06

申请号：US17700077

申请日：2022-03-21

Applicant: XILINX, INC.

Inventor： Zhaoyin Daniel Wu ,  Chuan Xie ,  Mayank Raj ,  Parag Upadhyaya

IPC: G02B6/12 ,  G02B6/293

CPC classification number: G02B6/12016 ,  G02B6/2938 ,  G02B6/29338 ,  G02B6/29395

Abstract: Disclosed herein is an optical filter configured for wavelength division and multiplexing capable of transmitting and receiving signals. The optical filter includes an optical waveguide configured to receive at an input multiple signals with different wavelengths. The optical filter includes a plurality of channels coupled at different locations along a length of the optical waveguide. Each of the plurality of channels is configured to transmit a respective one of the multiple signals. A number of ring filter stages in a first channel of the plurality of channels that is closer to the input of the optical waveguide is greater than a second channel in the plurality of channels further away from the input of the optical waveguide.

公开(公告)号：US11107770B1

公开(公告)日：2021-08-31

申请号：US16454629

申请日：2019-06-27

Applicant: XILINX, INC.

Inventor： Suresh Ramalingam ,  Kun-Yung Chang ,  Yohan Frans ,  Chuan Xie ,  Mayank Raj

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/49 ,  H01L25/18 ,  G02B6/42 ,  H01L25/00 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498

Abstract: An improved chip package, and methods for fabricating the same are provided that utilize two tier packaging of an optical die and another die commonly disposed over a substrate. In one example, a chip package is provided that includes an optical die, a core die, and an electrical/optical interface die are all disposed over a common substrate. In one example, a first routing region is provided between the core and electrical/optical interface dies, a second routing region is provided between the electrical/optical interface die and the optical dies, and a third routing region is disposed between the substrate and the core and electrical/optical interface dies.