Abstract:
An edge-covering material and a process for preventing undesirable ridges from exposure of laser-processible, photopolymerizable printing plates premounted on sleeves or cylinders is disclosed. The edge-covering material containing at least one soluble, film-forming polymer, at least one UV absorber, and a solvent or a solvent mixture is applied on the edges of the photo-polymerizable printing plate before imagewise exposure of the photopolymerizable printing plate.
Abstract:
The invention pertains to an apparatus and a process for forming a printing form from a photosensitive element having a cylindrical support, and in particular, to an apparatus and a process for thermally treating the photosensitive element to form a relief pattern and particularly to form a cylindrically-shaped flexographic printing form. The apparatus and process includes supporting the cylindrical support to accommodate thermal treating of photosensitive elements with various sizes of the cylindrical support.
Abstract:
A photopolymerizable mixture for photopolymerizable printing plates with an improved resistance to UV-hardenable printing inks, contains 10-45% by weight of at least one thermoplastic, elastomeric, block copolymer comprising of two or more polymer blocks comprising aromatic vinyl units and one or more polymer blocks comprising isoprene and/or isoprene/butadiene units. The block copolymer has a vinyl bond content not above 70%, a glass transition temperature not above 20.degree. C., and a peak temperature of a primary dispersion of tan .delta. not above 30.degree. C.
Abstract:
Process for lowering the viscosity of coating solutions containing a thixotropy-causing filler for the production of light-sensitive reproduction materials by adding at least one compound corresponding to one of the following formulas: ##STR1## wherein R is a linear saturated or unsaturated hydrocarbon chain having 2 to 12 carbon atoms, optionally substituted in which one or more carbon atoms can be replaced by N(R.sub.5), O, S, and/or an aromatic radial, or a 5 to 8 membered aliphatic ring.R.sub.1 to R.sub.4 are H, alkyl, aryl, and aralkyl, whereby R.sub.1 to R.sub.4 can be the same or different;R.sub.5 is R.sub.1 to R.sub.4 ;R.sub.6 and R.sub.7 are R.sub.1 to R.sub.4, --(CHR.sub.8).sub.p --OH;p is 1 to 6;q and r are 1 to 6 and can be the same or different;R.sub.8 is H, alkyl;R.sub.9 and R.sub.10 are H, alkyl, --(CHR.sub.8).sub.p --OH.
Abstract:
The invention relates to a packaging assembly for printing plates and a method for packing the printing plates including a packaging container having a base, and at least one printing plate positioned in the container adjacent the base, wherein an interface having a coefficient of friction of less than 0.30 is disposed between the plate and the base.
Abstract:
This invention pertains to a method and apparatus for thermally developing a photosensitive element, and particularly to a method and apparatus for supporting the photosensitive element with a removable flexible support member during thermal treatment.
Abstract:
This invention pertains to a method and apparatus for thermally developing a photosensitive element, and particularly to a method and apparatus for supporting the photosensitive element with a removable flexible support member during thermal treatment.
Abstract:
A process for making an electrically conductive pattern on a substrate comprising coating the substrate with a solution of salts containing at least one supplementary element, drying and heat treating the salt coating at a temperature lower than the temperature at which oxides form from the salts, then forming a metal conductive pattern on the heat treated supplementary element coating. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.
Abstract:
A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supplementary elements to the pattern. The patterned substrate is fired to volatilize theadhesive layer and sinter the powders. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.
Abstract:
This invention provides an apparatus and process for forming a printing form from a photosensitive element having an exterior surface and a composition layer capable of being partially liquefied. The apparatus includes a displaceable heater for heating the composition layer, means for removing at least a portion of the composition layer from the element, and means for displacing the displaceable heater to a predetermined distance from the exterior surface. Positioning the displaceable heater at the predetermined distance assures reproducible removal of the liquefied composition from the various types of photosensitive elements that can be thermally treated in the apparatus, resulting in the printing forms having improved relief surface uniformity.