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Patent Agency Ranking
公开(公告)号：US12021049B2
公开(公告)日：2024-06-25
申请号：US17623375
申请日：2021-12-20
Inventor： Shuya Dong , Bo Liu , Qiang Gong
CPC classification number: H01L24/06 , H01L24/05 , H01L24/32 , H01L25/18 , H01L2224/05553 , H01L2224/05568 , H01L2224/0603 , H01L2224/06132 , H01L2224/06133 , H01L2224/06515 , H01L2224/32147 , H01L2924/1426
Abstract: The present disclosure provides a display panel and a display device. The display panel includes an array substrate, a bonding area of the array substrate is provided with a plurality of bonding pads and a driving chip. A first area of the driving chip is at least provided with a plurality of first dummy terminals. A height difference caused by warping of driving terminals can be compensated by the first dummy terminals, thereby avoiding a phenomenon of shallow conduction. An insulation protective layer is provided on a part of the array substrate which is corresponding to the first dummy terminals, thereby preventing metal wirings from extrusion damage.
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公开(公告)号：US20240203859A1
公开(公告)日：2024-06-20
申请号：US17905171
申请日：2022-07-29
Inventor： Shuya Dong
IPC: H01L23/498 , H05K1/18
CPC classification number: H01L23/49838 , H05K1/189 , H05K2201/052 , H05K2201/10128
Abstract: A display panel and a display device are provided, wherein a terminal region of the display panel includes a first terminal region, a second terminal region, and a third terminal region. The display panel includes a plurality of first terminals and a second terminal, each of the plurality of first terminals is located in the first terminal region and close to the second terminal region, and the second terminal is located in the second terminal region and electrically connected to the first terminal by a first trace. A length direction of the first terminal extends through the second terminal region, and the first trace is located between the first terminal region and the second terminal region.
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公开(公告)号：US12211810B2
公开(公告)日：2025-01-28
申请号：US17613003
申请日：2021-10-20
Inventor： Shuya Dong , Haosen Ge , Yong Tian , Bo Liu
IPC: H01L23/00 , G02F1/1345 , H01L25/18 , H10K59/90
Abstract: The present application discloses a drive chip and a display panel. The drive chip includes a first area and a second area. The drive chip includes a substrate and drive pins. The density of the pins located in the first area is lower than the density of the pins located in the second area. The pins located in the second area includes first drive pins and second drive pins. The distance between the substrate and a face of the first drive pins away from the substrate is greater than the distance between the substrate and a face of the second drive pins away from the substrate. The occurrence of poor electric conduction is avoided.
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公开(公告)号：US12262605B2
公开(公告)日：2025-03-25
申请号：US17613509
申请日：2021-10-12
Inventor： Shuya Dong , Bo Liu , Qiang Gong
IPC: H10K59/131 , H01L23/00 , H10K59/90
Abstract: The present disclosure provides a display panel and a display device. A distance from a surface of a first conductive adhesive layer close to a first pin, electrically connecting the first conductive pad and the first pin, to the substrate is different from a distance of a surface of a second conductive adhesive layer electrically connected to the second conductive pad and the second pin to the substrate, to compensate for a height difference caused by the partial warpage of the pins on the drive chip when binding a drive chip, so as to ensure that the drive chip can be well bonded to the display panel.
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公开(公告)号：US20240055439A1
公开(公告)日：2024-02-15
申请号：US17613013
申请日：2021-10-12
Inventor： Shuya Dong , Bo Liu , Qiang Gong
IPC: H01L27/12
CPC classification number: H01L27/124
Abstract: A display panel and a display device are disclosed. The display panel includes bonding pads placed in the bonding region, a driving chip, and a conductive resin connected to the bonding pads. The driving chip comprises a first region close to the display region and a second region away from the display region. The second region has a plurality of driving terminals. The driving terminals and the corresponding bonding pads are one-by-one electrically connected to each other. The thickness of at least a part of the conductive resin corresponding to the first region is set to be greater than the thickness of the conductive resin corresponding to the second region to compensate the height difference caused by the raise of the driving terminals when the driving chip is bonded. This ensures that the driving chip could be well bonded on the display panel and avoids the shallow donor conductivity.
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