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公开(公告)号：US20240152010A1
公开(公告)日：2024-05-09
申请号：US17776384
申请日：2022-04-13
Inventor： Fan GONG , Guanghui LIU , Fei AI , Jiyue SONG , Dewei SONG , Rui HE
IPC: G02F1/1362 , G02F1/1368
CPC classification number: G02F1/136209 , G02F1/136222 , G02F1/1368
Abstract: Embodiments of the present disclosure provide a display panel and a display terminal. The display panel includes at least one ultraviolet sensing transistor and at least one control transistor disposed on a substrate, and a color film substrate including a light blocking unit; wherein the ultraviolet sensing transistor includes an ultraviolet absorbing layer, and an orthographic projection of the light blocking unit on the substrate covers an orthographic projection of the ultraviolet absorbing layer on the substrate. According to the embodiment of the present disclosure, the light blocking unit absorbs or blocks the visible lights to prevent the visible lights from entering into the ultraviolet absorbing layer.
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公开(公告)号：US20240421173A1
公开(公告)日：2024-12-19
申请号：US17596881
申请日：2021-12-15
Inventor： Jiyue SONG , Fei AI , Dewei SONG , Fan GONG
IPC: H01L27/146 , G02F1/1333 , G02F1/1368
Abstract: An embodiment of the present application discloses a display panel and a display panel manufacturing method. The photosensitive element and the thin film transistor device are disposed on the same side of the substrate. Some components of the photosensitive element and some components of the thin film transistor device can be manufactured by the same step, and therefore can improve integration of the photosensitive element on the array substrate. Furthermore, the photosensitive element can be integrated in the display panel with reduced photomasks and a lowered cost.
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公开(公告)号：US20230354624A1
公开(公告)日：2023-11-02
申请号：US17278694
申请日：2021-02-26
Inventor： Jiyue SONG , Fei AI , Dewei SONG , Fan GONG
CPC classification number: H10K30/80 , H10K39/32 , G06V40/1318
Abstract: An array substrate, a display panel, and a display device are provided by the present application. The array substrate includes a base substrate; a light-sensitive component layer disposed on the base substrate, wherein a plurality of light-sensitive components are disposed at intervals in the light-sensitive component layer; and a first light-shielding layer disposed on the light-sensitive component layer. An orthographic projection of the first light-shielding layer on the base substrate partially overlaps with an orthographic projection of each of the light-sensitive components on the array substrate.
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公开(公告)号：US20230137922A1
公开(公告)日：2023-05-04
申请号：US17287169
申请日：2021-04-14
Inventor： Fan GONG , Fei AI , Jiyue SONG
IPC: H10K59/60 , H10K59/80 , G02F1/1362
Abstract: An array substrate, a manufacturing process of an array substrate, and a display panel are disclosed. The array substrate includes a substrate and a photosensitive element. The photosensitive element is disposed on the substrate and includes a doped semiconductor layer, an intrinsic semiconductor layer, and a transparent electrode layer sequentially stacked. By improving an internal structure of the photosensitive element, light absorption by an incident interface of the intrinsic semiconductor layer can be increased, so that sensitivity of the photosensitive element is enhanced.
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Patent Agency Ranking
公开(公告)号：US20240233433A9
公开(公告)日：2024-07-11
申请号：US17769396
申请日：2022-03-10
Inventor： Fan GONG , Fei AI , Jiyue SONG , Dewei SONG
IPC: G06V40/13 , H01L27/12 , H01L31/0216
CPC classification number: G06V40/1318 , H01L27/124 , H01L31/02164
Abstract: A fingerprint collection device and a display panel are provided. The fingerprint collection device includes: a base substrate, a driving circuit layer, a first passivation layer, a photodiode, a second passivation layer, and an electrode layer. A first electrode portion is electrically connected to the photodiode through a second via. A second electrode portion is electrically connected to a first signal trace and a second signal trace through a third via and a fourth via to form a bridge structure. Since the third via, the fourth via, and the second via are formed in same process, one process can be saved.
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公开(公告)号：US20240135742A1
公开(公告)日：2024-04-25
申请号：US17769396
申请日：2022-03-10
Inventor： Fan GONG , Fei AI , Jiyue SONG , Dewei SONG
IPC: G06V40/13 , H01L27/12 , H01L31/0216
CPC classification number: G06V40/1318 , H01L27/124 , H01L31/02164
Abstract: A fingerprint collection device and a display panel are provided. The fingerprint collection device includes: a base substrate, a driving circuit layer, a first passivation layer, a photodiode, a second passivation layer, and an electrode layer. A first electrode portion is electrically connected to the photodiode through a second via. A second electrode portion is electrically connected to a first signal trace and a second signal trace through a third via and a fourth via to form a bridge structure. Since the third via, the fourth via, and the second via are formed in same process, one process can be saved.
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公开(公告)号：US20240038793A1
公开(公告)日：2024-02-01
申请号：US17278342
申请日：2020-12-31
Inventor： Fei AI , Fan GONG , Jiyue SONG , Dewei SONG , Shiyu LONG
IPC: H01L27/146
CPC classification number: H01L27/14612 , H01L27/14649 , H01L27/14683
Abstract: An array substrate and a manufacturing method thereof are provided. The array substrate includes a thin film transistor layer including a first thin film transistor and an infrared detection element disposed on a first side of the thin film transistor layer. The infrared detection element includes a first electrode, a light-absorbing layer, and a second electrode sequentially stacked, wherein the infrared detection element is electrically connected to the first thin film transistor, and wherein a material of the light-absorbing layer is microcrystalline silicon. A thickness and band gap of the microcrystalline silicon simultaneously fulfill a purpose of infrared detection.
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公开(公告)号：US20230215881A1
公开(公告)日：2023-07-06
申请号：US17593659
申请日：2021-07-26
Inventor： Fan GONG , Fei Al , Jiyue SONG
IPC: H01L27/144 , H01L27/12
CPC classification number: H01L27/1446 , H01L27/1288
Abstract: An array substrate, a manufacturing method of the array substrate, and a display panel are provided. The array substrate includes a photosensitive sensor. The photosensitive sensor includes a photosensitive module and a storage module. The photosensitive module includes a photosensitive semiconductor layer. The storage module includes a first electrode plate and a second electrode plate. Wherein, the photosensitive semiconductor layer is disposed on an extension section of a drain electrode. A number of film layer of the photosensitive sensor is decreased, and photomasks are saved.
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公开(公告)号：US20230154949A1
公开(公告)日：2023-05-18
申请号：US17281268
申请日：2021-03-11
Inventor： Fuhsiung TANG , Fan GONG , Fei AI , Jiyue SONG
IPC: H01L27/146 , G06V40/13
CPC classification number: H01L27/14612 , G06V40/1318 , H01L27/14678
Abstract: An array substrate and a display panel are provided. The array substrate includes a substrate, and a switch component and a light-sensing component adjacent to each other and disposed on the substrate. The switch component includes a first semiconductor disposed on the substrate. The light-sensing component includes a second semiconductor disposed on a same layer as the first semiconductor and a light-sensing electrode disposed on a side of the second semiconductor away from the substrate and connected to the second semiconductor. The light-sensing electrode and the second semiconductor constitute a Schottky knot.
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