公开(公告)号：US20190296522A1

公开(公告)日：2019-09-26

申请号：US16359879

申请日：2019-03-20

申请人： Vixar, Inc.

发明人： Klein L. JOHNSON ,  David SANDQUIST ,  Mary K. HIBBS-BRENNER

IPC分类号： H01S5/183 ,  H01S5/022 ,  H01S5/026

摘要： The present disclosure relates to a packaging approach for ensuring that high power optical modules incorporating VCSELs and VCSEL arrays remain eye safe. A VCSEL device or VCSEL package of the present disclosure may generally be configured certifying an optical device as eye safe such that the device is able to survive a single failure mode. In other embodiments, a multiple lens array is arranged above the VCSEL, which scatters the light into a wide range of angles such that a higher percentage of light will reach the photodetector located beside the VCSEL. In other embodiments according to the present disclosure, one or more methods and circuits are provided to detect and correct errors or failures caused by one or more unsafe conditions.

公开(公告)号：US20240295635A1

公开(公告)日：2024-09-05

申请号：US18661763

申请日：2024-05-13

申请人： Vixar, Inc.

发明人： Matthew M. DUMMER ,  Klein L. JOHNSON ,  Mary HIBBS-BRENNER ,  Dadi SETIADI ,  Benjamin OLSON

IPC分类号： G01S7/481 ,  H01S5/0234 ,  H01S5/026 ,  H01S5/042 ,  H01S5/062 ,  H01S5/183 ,  H01S5/32 ,  H01S5/42

CPC分类号： G01S7/4815 ,  G01S7/4813 ,  H01S5/0234 ,  H01S5/0264 ,  H01S5/04256 ,  H01S5/06203 ,  H01S5/18305 ,  H01S5/32 ,  H01S5/423

摘要： The present invention relates to a Vertical-Cavity Surface-Emitting Laser (VCSEL) die comprising a VCSEL array configured for flip chip bonding to a substrate with the VCSEL array being designed for emission from a substrate side of the chip, integrated beam shaping optics and electrical contacts including a top surface contact and an etched metal connection through a top mirror structure to a bottom n-mirror, or to an n-doped buffer layer under the bottom n-mirror or to the substrate. The invention further relates to an assembly comprising the above VCSEL die and a photodetector in which the VCSEL die is attached to a circuit board or sub-mount with a solder or bump bonds on the VCSEL die and the photodetector is placed on a same circuit board or sub-mount right next to the VCSEL die.

公开(公告)号：US20200259310A1

公开(公告)日：2020-08-13

申请号：US16820376

申请日：2020-03-16

申请人： Vixar, Inc.

发明人： Klein L. JOHNSON ,  David SANDQUIST ,  Mary K. HIBBS-BRENNER

IPC分类号： H01S5/0683 ,  H01S5/42 ,  H01S5/022

摘要： The present disclosure relates to an approach for monitoring the output power of a VCSEL or VCSEL array in a relatively compact, low profile package. A VCSEL device or VCSEL package of the present disclosure may generally be configured with a photodiode for monitoring output power of one or more VCSELs. In some embodiments, one or more VCSEL devices may be arranged over or on a photodetector, such that the photodetector is configured to detect light emitted through a bottom of the VCSEL. In such embodiments, the VCSEL device may have a patterned bottom metal layer and/or an etched substrate to allow light to pass below or behind the VCSEL to the photodiode. In other embodiments, a photodetector may be arranged on a submount adjacent one or more VCSELs, and may be configured to detect light reflected via a diffuser in order to monitor output power.