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1.发明公开公开(公告)号：US20240297093A1
公开(公告)日：2024-09-05
申请号：US18645678
申请日：2024-04-25
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/373 , H01L23/495 , H01L23/498 , H05K1/18 , H05K3/34
CPC classification number: H01L23/3735 , H01L23/49838 , H05K3/341 , H01L23/49562 , H05K1/181 , H05K2201/10166 , H05K2201/10378
Abstract: A heat dissipation device for soldering onto a printed circuit board for a semiconductor component arrangement. The device includes a semiconductor component a first electrical connector and at least one further electrical connector and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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公开(公告)号：US20230358627A1
公开(公告)日：2023-11-09
申请号：US18356624
申请日：2023-07-21
Applicant: Vitesco Technologies GmbH
Inventor： Thomas Riepl
CPC classification number: G01L7/088 , G01D3/0365
Abstract: The disclosure relates to a method and a device for determining an ambient pressure that prevails around a control unit. The control unit includes a housing, which has an opening, and a membrane having a particular permeability, which covers the opening. A pressure sensor is arranged inside the housing. The method includes: recording a pressure measurement value with the pressure sensor, the pressure measurement value being characteristic of an internal pressure inside the housing; determining a correction value, which includes a constant and a variable; and determining the ambient pressure by way of the pressure measurement value that has been determined and the correction value that has been determined.
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3.发明申请公开(公告)号：US20210384689A1
公开(公告)日：2021-12-09
申请号：US17285222
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Thomas Riepl , Thomas Bäumler , Christian Braun
Abstract: A first and second substrate, and electrically conductive first and second connection parts are provided in a method for establishing an electrically conductive connection between two substrates. The first connection part is mounted on the first substrate by a first releasable connection and the second connection part is respectively mounted on the second substrate by a releasable connection. An electrically conductive connection assembly containing the first connection part and the second connection part is established by either a cohesive connection between a connection portion of the first connection part and a connection portion of the second connection part or an electrically conductive crossmember provided and a cohesive connection of a first length portion of the crossmember to the connection portion of the first connection part and a second cohesive connection of a second length portion of the crossmember to the connection portion of the second connection part being established.
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Patent Agency Ranking
4.发明授权公开(公告)号：US12046531B2
公开(公告)日：2024-07-23
申请号：US17285295
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/00 , H01L23/373 , H01L23/498 , H05K3/34 , H01L23/495 , H05K1/18
CPC classification number: H01L23/3735 , H01L23/49838 , H05K3/341 , H01L23/49562 , H05K1/181 , H05K2201/10166 , H05K2201/10378
Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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公开(公告)号：US11798873B2
公开(公告)日：2023-10-24
申请号：US16755660
申请日：2018-10-05
Applicant: VITESCO TECHNOLOGIES GMBH
Inventor： Detlev Bagung , Thomas Riepl , Daniela Wolf , Christina Quest-Matt
IPC: H01L23/498 , H01L23/31 , H01L23/00 , H05K1/02 , H05K1/11
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L24/48 , H05K1/0206 , H05K1/111 , H01L2224/48227 , H05K2201/09227 , H05K2201/10734
Abstract: A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.
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公开(公告)号：US11503719B2
公开(公告)日：2022-11-15
申请号：US16755656
申请日：2018-10-04
Applicant: VITESCO TECHNOLOGIES GMBH
Inventor： Gregory Drew , Thomas Riepl , Detlev Bagung
Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.
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7.发明授权公开(公告)号：US12046863B2
公开(公告)日：2024-07-23
申请号：US17285222
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Thomas Riepl , Thomas Bäumler , Christian Braun
CPC classification number: H01R43/0263 , H01R12/52 , H01R12/7082 , H01R12/73 , H01R12/732 , H01R4/029 , H01R13/03 , H01R43/0214 , H01R43/0221
Abstract: A first and second substrate, and electrically conductive first and second connection parts are provided in a method for establishing an electrically conductive connection between two substrates. The first connection part is mounted on the first substrate by a first releasable connection and the second connection part is respectively mounted on the second substrate by a releasable connection. An electrically conductive connection assembly containing the first connection part and the second connection part is established by either a cohesive connection between a connection portion of the first connection part and a connection portion of the second connection part or an electrically conductive crossmember provided and a cohesive connection of a first length portion of the crossmember to the connection portion of the first connection part and a second cohesive connection of a second length portion of the crossmember to the connection portion of the second connection part being established.
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8.发明申请公开(公告)号：US20220115290A1
公开(公告)日：2022-04-14
申请号：US17285295
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/373 , H01L23/498 , H05K3/34
Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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