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1.发明授权公开(公告)号：US12046531B2
公开(公告)日：2024-07-23
申请号：US17285295
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/00 , H01L23/373 , H01L23/498 , H05K3/34 , H01L23/495 , H05K1/18
CPC classification number: H01L23/3735 , H01L23/49838 , H05K3/341 , H01L23/49562 , H05K1/181 , H05K2201/10166 , H05K2201/10378
Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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公开(公告)号：US11798873B2
公开(公告)日：2023-10-24
申请号：US16755660
申请日：2018-10-05
Applicant: VITESCO TECHNOLOGIES GMBH
Inventor： Detlev Bagung , Thomas Riepl , Daniela Wolf , Christina Quest-Matt
IPC: H01L23/498 , H01L23/31 , H01L23/00 , H05K1/02 , H05K1/11
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L24/48 , H05K1/0206 , H05K1/111 , H01L2224/48227 , H05K2201/09227 , H05K2201/10734
Abstract: A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.
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公开(公告)号：US11503719B2
公开(公告)日：2022-11-15
申请号：US16755656
申请日：2018-10-04
Applicant: VITESCO TECHNOLOGIES GMBH
Inventor： Gregory Drew , Thomas Riepl , Detlev Bagung
Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.
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公开(公告)号：US11140774B2
公开(公告)日：2021-10-05
申请号：US16753894
申请日：2018-10-04
Applicant: VITESCO TECHNOLOGIES GMBH
Inventor： Christian Lammel , Guenther Ruppaner , Robert Bushnell , Detlev Bagung
Abstract: A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.
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公开(公告)号：US20220400567A1
公开(公告)日：2022-12-15
申请号：US17840808
申请日：2022-06-15
Applicant: Vitesco Technologies GmbH
Inventor： Christian Pump , Detlev Bagung
Abstract: A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls. The circuit components are accommodated only in the first accommodation-chamber section and the plug components are accommodated only in the second accommodation-chamber section.
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Patent Agency Ranking
公开(公告)号：US11917798B2
公开(公告)日：2024-02-27
申请号：US17270542
申请日：2019-08-13
Applicant: Vitesco Technologies GmbH
Inventor： Gregory Drew , Detlev Bagung , Jürgen Bock
IPC: H05K7/20 , B60L53/302 , B60K1/00
CPC classification number: H05K7/20927 , B60L53/302 , H05K7/20 , H05K7/20872 , B60K2001/005 , H05K7/208
Abstract: A charging device module for installation in an electrically driveable vehicle, including a charging device and an internal cooling circuit for cooling the charging device, wherein the internal cooling circuit has connections for connection to a superordinate cooling circuit of the vehicle, wherein the connections comprise at least one inlet and at least one outlet, and a bypass line connects the at least one inlet to the at least one outlet while bypassing the internal cooling circuit, wherein an actuable valve is associated with the at least one inlet, by which valve the flow of coolant through the internal cooling circuit and the bypass line can be controlled.
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7.发明申请公开(公告)号：US20220115290A1
公开(公告)日：2022-04-14
申请号：US17285295
申请日：2019-10-08
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/373 , H01L23/498 , H05K3/34
Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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8.发明公开公开(公告)号：US20240297093A1
公开(公告)日：2024-09-05
申请号：US18645678
申请日：2024-04-25
Applicant: Vitesco Technologies GmbH
Inventor： Detlev Bagung , Christina Quest-Matt , Thomas Riepl , Daniela Wolf
IPC: H01L23/373 , H01L23/495 , H01L23/498 , H05K1/18 , H05K3/34
CPC classification number: H01L23/3735 , H01L23/49838 , H05K3/341 , H01L23/49562 , H05K1/181 , H05K2201/10166 , H05K2201/10378
Abstract: A heat dissipation device for soldering onto a printed circuit board for a semiconductor component arrangement. The device includes a semiconductor component a first electrical connector and at least one further electrical connector and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.
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9.发明公开公开(公告)号：US20240096738A1
公开(公告)日：2024-03-21
申请号：US17768044
申请日：2020-10-06
Applicant: Vitesco Technologies GmbH
Inventor： Christina Quest-Matt , Detlev Bagung , Daniela Wolf
IPC: H01L23/373 , H01L23/00 , H01L23/498
CPC classification number: H01L23/3736 , H01L23/3737 , H01L23/49822 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/83801
Abstract: A power semiconductor component includes at least one power semiconductor device disposed within a housing and a heat sink having an area a exposed on a first surface of the housing. A wiring substrate has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is disposed on the second main surface. The heat dissipation region has an area A on the second main surface, and a
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公开(公告)号：US11737225B2
公开(公告)日：2023-08-22
申请号：US17840808
申请日：2022-06-15
Applicant: Vitesco Technologies GmbH
Inventor： Christian Pump , Detlev Bagung
CPC classification number: H05K5/0247 , H05K5/0047 , H05K9/0033 , H05K9/0037
Abstract: A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls. The circuit components are accommodated only in the first accommodation-chamber section and the plug components are accommodated only in the second accommodation-chamber section.
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