公开(公告)号：US20240260168A1

公开(公告)日：2024-08-01

申请号：US18565359

申请日：2022-06-08

Applicant: VITESCO TECHNOLOGIES GMBH

Inventor： Detlev Bagung ,  Christina QUEST-MATT ,  Holger BALDREICH

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H05K3/0094 ,  H05K3/341 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2201/09609

Abstract: A circuit board (1) for a power semiconductor module (13), having at least one top side (2) and one bottom side (3), wherein at least one mounting area (4) for a power semiconductor component (12) is provided on the top side (2), wherein on the mounting area (4), at least one solder layer (8) is provided for connecting at least one power semiconductor component (12) to the mounting area (4), which layer is divided into regions (9) that are separated from one another by means of intermediate spaces (11), and wherein multiple thermal vias (5) are provided in the circuit board (1) and extend from the top side (2) to the bottom side (3) of the circuit board (2) in the region of the mounting area (4), wherein each upper opening (6) of the thermal vias (5) is directly surrounded by a respective region (9) of the solder layer (8) and each lower opening (7) of the vias (5) is covered by a layer (10) of electrically insulating material.