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    METHOD OF CONTROLLING OXYGEN LEVELS FOR ELECTROLESS PLATING OF CATALYTIC FINE LINES OR FEATURES
    1.
    发明申请
    METHOD OF CONTROLLING OXYGEN LEVELS FOR ELECTROLESS PLATING OF CATALYTIC FINE LINES OR FEATURES 审中-公开
    控制催化细管线或特性的电镀镀层的氧含量的方法

    公开(公告)号：US20160040294A1

    公开(公告)日：2016-02-11

    申请号：US14455181

    申请日：2014-08-08

    申请人： Uni-Pixel Displays, Inc.

    发明人： Danliang Jin ,  John-Paul O'Neil ,  Yieu Chyan

    IPC分类号： C23C18/16

    CPC分类号： C23C18/1683 ,  C23C18/1608 ,  C23C18/1617 ,  C23C18/1675

    摘要： A method of controlling oxygen levels for electroless plating of catalytic fine lines or features includes selecting a substrate that includes a plurality of catalytic lines or features that are part of or are disposed on the substrate. The plurality of catalytic lines or features include at least one catalytic fine line or feature and at least one catalytic standard line or feature. A dissolved oxygen concentration of an electroless plating solution is regulated to a candidate controlled oxygen level. The candidate controlled oxygen level is set to a smallest value in a regulated range in a first pass of the method. The substrate is submerged in the solution for a period of time sufficient to initiate plating of the at least one catalytic standard line or feature. The substrate is evaluated and candidate controlled oxygen level is incremented or the previous value is selected as the regulated oxygen level.

    摘要翻译： 控制催化细线或特征的化学镀的氧含量的方法包括选择包括多个催化剂线的基材或者作为基材的一部分或者被设置在基材上的特征。 多个催化剂线或特征包括至少一个催化细线或特征以及至少一个催化标准品系或特征。 将化学镀溶液的溶解氧浓度调节到候选受控氧水平。 在该方法的第一次通过中，候选控制氧水平被设定在调节范围内的最小值。 将基底浸入溶液中足以引发至少一种催化标准品系或特征的电镀的时间。 评估底物，并增加候选控制氧水平，或选择先前的值作为调节氧水平。

    ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH
    3.
    发明申请
    ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH 审中-公开
    用于受控衬底深度的辊对电镀电镀系统

    公开(公告)号：US20160040290A1

    公开(公告)日：2016-02-11

    申请号：US14495373

    申请日：2014-09-24

    申请人： Uni-Pixel Displays, Inc.

    发明人： Yieu Chyan ,  Danliang Jin ,  John-Paul O'Neil

    IPC分类号： C23C18/16

    CPC分类号： C23C18/163 ,  C23C18/1632 ,  C23C18/1655 ,  C23C18/1675 ,  C23C18/1683

    摘要： A roll-to-roll electroless plating system for controlled substrate depth includes electroless plating solution disposed within an electroless plating bath, a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution, a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution, and a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution. A diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution.

    摘要翻译： 用于受控衬底深度的卷对卷化学镀系统包括设置在化学镀浴内的化学镀溶液，被配置为将卷对卷衬底材料输送通过化学镀溶液的输送系统，布置在第一深度设定辊 在所述卷对卷基板材料到所述化学镀溶液的入口处，以及设置在所述卷对卷基板材料的离开所述化学镀溶液的出口位置处的第二深度设定辊。 选择第一和第二深度设定辊的直径以将卷对卷衬底材料设置在化学镀溶液的预定深度处。

    METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSMISSION, LOW REFLECTANCE, AND LOW VISIBILITY
    4.
    发明申请
    METHOD OF FABRICATING A CONDUCTIVE PATTERN WITH HIGH OPTICAL TRANSMISSION, LOW REFLECTANCE, AND LOW VISIBILITY 审中-公开
    具有高光传输，低反射和低可视性的导电图案的制作方法

    公开(公告)号：US20150309600A1

    公开(公告)日：2015-10-29

    申请号：US14259507

    申请日：2014-04-23

    申请人： Uni-Pixel Displays, Inc.

    发明人： Ed S. Ramakrishnan ,  Danliang Jin ,  Yieu Chyan

    IPC分类号： G06F3/041 ,  H01B13/22 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42

    CPC分类号： G06F3/041 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/40 ,  C23C18/54 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

    摘要： A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a plated image. The first metal includes copper. The plated image is bathed in an immersion bath that includes a metal ion source of a second metal that reacts with the first metal. The second metal includes palladium. The conductive pattern includes a first metal layer having a first metal thickness, an intermetallic first metal-second metal interface layer, and a second metal layer having a second metal thickness.

    摘要翻译： 制造导电图案的方法包括将导电图案的图像设置在基板上。 该图像包括能够无电镀的材料。 该图像是用形成电镀图像的第一金属无电镀。 第一种金属包括铜。 将镀覆的图像沐浴在包含与第一金属反应的第二金属的金属离子源的浸浴中。 第二种金属包括钯。 导电图案包括具有第一金属厚度的第一金属层，金属间第一金属 - 第二金属界面层和具有第二金属厚度的第二金属层。