Abstract:
A mixture comprising A) a polymer obtainable by polymerizing free-radically polymerizable compounds, and B) compounds containing ethylenically unsaturated, free-radically polymerizable groups (polymerizable groups for short) and having a weight-average molecular weight Mw of less than 5000 g/mol, wherein at least 10% by weight of the compounds B are compounds B1 containing at least one nonaromatic ring system.
Abstract:
A mixture having (A) a polymer obtain by polymerizing at least one free-radically polymerizable compound; and (B) at least one compound having at least one ethylenically unsaturated, free-radically polymerizable group and having a weight-average molecular weight Mw of less than 5000 g/mol, wherein at least 10% by weight of compounds (B) are one or more compounds B1 with at least one nonaromatic ring system.
Abstract:
A description is given of a process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds, where a first starting compound, which has an acid halide group, and a second starting compound, which has an alcoholic hydroxyl group, are esterified with one another in a solvent or in a solvent mixture. The solvent comprises one or more ketones having a boiling point of below 150° C. under atmospheric pressure (1 bar), or the solvent mixture is composed to an extent of at least 50% by weight of said ketones. One of the two starting compounds has at least one radiation-sensitive group and the other of the two starting compounds has at least one ethylenically unsaturated, free-radically polymerizable group. A description is also given of corresponding solutions of radiation-sensitive, free-radically polymerizable organic compounds and of their use for preparing radiation-crosslinkable, free-radically copolymerized copolymers, more particularly for hotmelt pressure-sensitive adhesives or aqueous polymer dispersions.
Abstract:
A description is given of a process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds, where a first starting compound, which has an acid halide group, and a second starting compound, which has an alcoholic hydroxyl group, are esterified with one another in a solvent or in a solvent mixture. The solvent comprises one or more ketones having a boiling point of below 150° C. under atmospheric pressure (1 bar), or the solvent mixture is composed to an extent of at least 50% by weight of said ketones. One of the two starting compounds has at least one radiation-sensitive group and the other of the two starting compounds has at least one ethylenically unsaturated, free-radically polymerizable group. A description is also given of corresponding solutions of radiation-sensitive, free-radically polymerizable organic compounds and of their use for preparing radiation-crosslinkable, free-radically copolymerized copolymers, more particularly for hotmelt pressure-sensitive adhesives or aqueous polymer dispersions.
Abstract:
Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl(meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C C double bonds and has a K value of less than or equal to 20. The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.
Abstract:
Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl (meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C—C double bonds and has a K value of less than or equal to 20.The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.
Abstract:
The present invention relates to microcapsule dispersions comprising microcapsules in a hydrophobic solvent, wherein the microcapsules have a capsule core, comprising a water-soluble organic substance, and a capsule shell which is composed essentially of reaction products of polyisocyanates with polyfunctional amines, and also to a process for preparing them and additionally to microcapsules obtainable from the corresponding microcapsule dispersions.
Abstract:
The present invention relates to microcapsule dispersions comprising microcapsules having a capsule core comprising water-soluble organic substances, and a capsule coating which essentially consists of polyurethane and/or polyurea, in a hydrophobic solvent which consists of 50 to 100% by weight of glycerol ester oils and 0 to 50% by weight of solvents miscible with glycerol ester oils, and to a process for their preparation.
Abstract:
The use of a composition of low or no tack at 20° C. as an adhesive that can be adhered to itself (referred to below for short as an autoadhesive).
Abstract:
Microcapsules having a capsule core comprising water-soluble organic substances, and a capsule coating which is a condensate of formaldehyde resins and/or alkyl ethers thereof, a process for their preparation, their use, and compositions comprising the microcapsules.