PROCESS FOR PREPARING SOLUTIONS OF RADIATION-SENSITIVE, FREE-RADICALLY POLYMERIZABLE ORGANIC COMPOUNDS
    3.
    发明申请
    PROCESS FOR PREPARING SOLUTIONS OF RADIATION-SENSITIVE, FREE-RADICALLY POLYMERIZABLE ORGANIC COMPOUNDS 有权
    制备辐射敏感性,无机可聚合有机化合物溶液的方法

    公开(公告)号:US20120016079A1

    公开(公告)日:2012-01-19

    申请号:US13258899

    申请日:2010-03-30

    Abstract: A description is given of a process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds, where a first starting compound, which has an acid halide group, and a second starting compound, which has an alcoholic hydroxyl group, are esterified with one another in a solvent or in a solvent mixture. The solvent comprises one or more ketones having a boiling point of below 150° C. under atmospheric pressure (1 bar), or the solvent mixture is composed to an extent of at least 50% by weight of said ketones. One of the two starting compounds has at least one radiation-sensitive group and the other of the two starting compounds has at least one ethylenically unsaturated, free-radically polymerizable group. A description is also given of corresponding solutions of radiation-sensitive, free-radically polymerizable organic compounds and of their use for preparing radiation-crosslinkable, free-radically copolymerized copolymers, more particularly for hotmelt pressure-sensitive adhesives or aqueous polymer dispersions.

    Abstract translation: 描述了制备具有卤化物基团的第一起始化合物和具有醇羟基的第二起始化合物的辐射敏感的可自由基聚合的有机化合物的溶液的方法,所述方法被酯化 彼此在溶剂或溶剂混合物中。 溶剂包含一种或多种在大气压(1巴)下沸点低于150℃的酮,或溶剂混合物的组成为所述酮的至少50重量%。 两种起始化合物中的一种具有至少一个辐射敏感性基团,并且两种起始化合物中的另一种具有至少一个烯键式不饱和的可自由基聚合的基团。 还给出了对辐射敏感的可自由基聚合的有机化合物的相应解决方案的描述,以及它们用于制备辐射可交联的自由基共聚共聚物的用途,更特别地用于热熔粘合剂或水性聚合物分散体。

    Process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds
    4.
    发明授权
    Process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds 有权
    制备辐射敏感的可自由基聚合的有机化合物的方法

    公开(公告)号:US08648212B2

    公开(公告)日:2014-02-11

    申请号:US13258899

    申请日:2010-03-30

    Abstract: A description is given of a process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds, where a first starting compound, which has an acid halide group, and a second starting compound, which has an alcoholic hydroxyl group, are esterified with one another in a solvent or in a solvent mixture. The solvent comprises one or more ketones having a boiling point of below 150° C. under atmospheric pressure (1 bar), or the solvent mixture is composed to an extent of at least 50% by weight of said ketones. One of the two starting compounds has at least one radiation-sensitive group and the other of the two starting compounds has at least one ethylenically unsaturated, free-radically polymerizable group. A description is also given of corresponding solutions of radiation-sensitive, free-radically polymerizable organic compounds and of their use for preparing radiation-crosslinkable, free-radically copolymerized copolymers, more particularly for hotmelt pressure-sensitive adhesives or aqueous polymer dispersions.

    Abstract translation: 描述了制备具有卤化物基团的第一起始化合物和具有醇羟基的第二起始化合物的辐射敏感的可自由基聚合的有机化合物的溶液的方法,所述方法被酯化 彼此在溶剂或溶剂混合物中。 溶剂包含一种或多种在大气压(1巴)下沸点低于150℃的酮,或溶剂混合物的组成为所述酮的至少50重量%。 两种起始化合物中的一种具有至少一个辐射敏感性基团,并且两种起始化合物中的另一种具有至少一个烯键式不饱和的可自由基聚合的基团。 还给出了对辐射敏感的可自由基聚合的有机化合物的相应解决方案的描述,以及它们用于制备辐射可交联的自由基共聚共聚物的用途,更特别地用于热熔粘合剂或水性聚合物分散体。

    Hotmelt adhesive comprising radiation-crosslinkable poly(meth)acrylate and oligo(meth)acrylate with nonacrylic C-C double bonds
    5.
    发明授权
    Hotmelt adhesive comprising radiation-crosslinkable poly(meth)acrylate and oligo(meth)acrylate with nonacrylic C-C double bonds 有权
    包含可辐射交联的聚(甲基)丙烯酸酯和具有非丙烯酸C-C双键的低聚(甲基)丙烯酸酯)的热熔粘合剂

    公开(公告)号:US08871827B2

    公开(公告)日:2014-10-28

    申请号:US13487550

    申请日:2012-06-04

    CPC classification number: C09J133/10 C08L2312/06 Y10T428/2826

    Abstract: Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl(meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C C double bonds and has a K value of less than or equal to 20. The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.

    Abstract translation: 描述了一种辐射可交联的热熔粘合剂,其包含至少一种以至少60重量%的C 1 -C 10烷基(甲基)丙烯酸酯和至少一种低聚(甲基)丙烯酸酯的至少一种可辐射交联的聚(甲基)丙烯酸酯的程度形成的至少一种低聚(甲基)丙烯酸酯, 包括非丙烯酸CC双键,并且具有小于或等于20的K值。热熔粘合剂包括光引发剂,其可以不附着于聚(甲基)丙烯酸酯的添加剂形式存在和/或不附着于聚 低级(甲基)丙烯酸酯可以通过共聚合引入聚(甲基)丙烯酸酯中,和/或可以连接到低聚(甲基)丙烯酸酯上。 热熔粘合剂可用于生产胶带。

    HOTMELT ADHESIVE COMPRISING RADIATION-CROSSLINKABLE POLY(METH)ACRYLATE AND OLIGO(METH)ACRYLATE WITH NONACRYLIC C-C DOUBLE BONDS
    6.
    发明申请
    HOTMELT ADHESIVE COMPRISING RADIATION-CROSSLINKABLE POLY(METH)ACRYLATE AND OLIGO(METH)ACRYLATE WITH NONACRYLIC C-C DOUBLE BONDS 有权
    含有非丙烯酸C-C双键的辐射可交联聚(甲基)丙烯酸酯和低聚(甲基)丙烯酸酯的热熔胶

    公开(公告)号:US20120315474A1

    公开(公告)日:2012-12-13

    申请号:US13487550

    申请日:2012-06-04

    CPC classification number: C09J133/10 C08L2312/06 Y10T428/2826

    Abstract: Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl (meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C—C double bonds and has a K value of less than or equal to 20.The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.

    Abstract translation: 描述了一种辐射可交联的热熔粘合剂,其包含至少一种以至少60重量%的C 1 -C 10烷基(甲基)丙烯酸酯和至少一种低聚(甲基)丙烯酸酯的至少一种可辐射交联的聚(甲基)丙烯酸酯的程度形成的至少一种低聚(甲基)丙烯酸酯, 包括非丙烯酸C-C双键,并且具有小于或等于20的K值。热熔粘合剂包括光引发剂,其可以不附着于聚(甲基)丙烯酸酯和/或未附着的添加剂的形式存在 (甲基)丙烯酸酯可以通过共聚合引入聚(甲基)丙烯酸酯中,和/或可以连接到低聚(甲基)丙烯酸酯上。 热熔粘合剂可用于生产胶带。

    Microcapsule Dispersions
    7.
    发明申请
    Microcapsule Dispersions 审中-公开
    微胶囊分散体

    公开(公告)号:US20080103265A1

    公开(公告)日:2008-05-01

    申请号:US11718687

    申请日:2005-10-27

    CPC classification number: B01J13/16

    Abstract: The present invention relates to microcapsule dispersions comprising microcapsules in a hydrophobic solvent, wherein the microcapsules have a capsule core, comprising a water-soluble organic substance, and a capsule shell which is composed essentially of reaction products of polyisocyanates with polyfunctional amines, and also to a process for preparing them and additionally to microcapsules obtainable from the corresponding microcapsule dispersions.

    Abstract translation: 本发明涉及在疏水性溶剂中包含微胶囊的微胶囊分散体,其中微胶囊具有包含水溶性有机物质的胶囊核心,以及基本上由多异氰酸酯与多官能胺的反应产物组成的胶囊壳,还涉及 一种制备它们的方法以及可从相应的微胶囊分散体获得的微胶囊。

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