SHEAR CUTTER PICK MILLING SYSTEM
    3.
    发明申请
    SHEAR CUTTER PICK MILLING SYSTEM 审中-公开
    切割切割机铣削系统

    公开(公告)号:US20140339883A1

    公开(公告)日:2014-11-20

    申请号:US14275574

    申请日:2014-05-12

    IPC分类号: E21C35/183

    摘要: This disclosure relates to a system for removing road material. In an embodiment, the system may include a milling drum and at least one pick mounted on the milling drum. Furthermore, the pick may include polycrystalline diamond at least partially forming one or more working surfaces of the pick.

    摘要翻译: 本公开涉及一种用于去除道路材料的系统。 在一个实施例中,系统可以包括研磨鼓和安装在研磨鼓上的至少一个拾取头。 此外,拾取可以包括至少部分地形成拾取的一个或多个工作表面的多晶金刚石。

    Polycrystalline diamond compact including a non-uniformly leached polycrystalline diamond table and applications therefor

    公开(公告)号:US10364613B1

    公开(公告)日:2019-07-30

    申请号:US15862831

    申请日:2018-01-05

    IPC分类号: E21B10/55 B24D99/00 B24D3/06

    摘要: In an embodiment, a polycrystalline diamond compacts (“PDC”) includes a substrate and a polycrystalline diamond (“PCD”) table bonded to the substrate. The PCD table defines an upper surface and at least one peripheral surface. The PCD table includes a plurality of bonded diamond grains. The PCD table includes a first region adjacent to the substrate that includes a metallic constituent disposed interstitially between the bonded diamond grains thereof, and a leached second region extending inwardly from the upper surface and the at least one peripheral surface that is depleted of the metallic constituent. The leached second region exhibits a leach depth profile having a maximum leach depth that is measured from the upper surface. A leach depth of the leach depth profile decreases with lateral distance from a central axis of the PCD table and toward the at least one peripheral surface.