公开(公告)号：US20150316677A1

公开(公告)日：2015-11-05

申请号：US14761994

申请日：2013-01-23

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： Eli Cole Warren ,  Jerusalem Nagash

IPC: G01V3/08 ,  B05D1/32 ,  B05D5/02 ,  G01V13/00 ,  B23K1/00 ,  B32B38/04 ,  B23K31/02 ,  H05K3/10 ,  B05D1/08 ,  B32B37/24

CPC classification number: G01V3/088 ,  B05D1/08 ,  B05D1/32 ,  B05D5/02 ,  B23K1/0016 ,  B23K31/02 ,  B32B37/24 ,  B32B38/04 ,  B32B2037/243 ,  B32B2038/047 ,  B32B2307/202 ,  B32B2457/00 ,  G01B7/22 ,  G01V13/00 ,  H03K17/955 ,  H03K2217/960755 ,  H05K3/10 ,  Y10T29/49156 ,  Y10T156/1056

Abstract: A proximity sensor includes a lead supported on an outer surface of a case structure and a sensor wire that extends from the lead and through an opening in the case structure. The sensor is formed by applying alternating layers of electrically conductive and non-conductive materials in a non-cured state. A base non-conductive layer is applied to an inner surface of the case structure around the sensor wire in a non-cured state. Once cured, a conductive layer is deposited onto the base non-conductive layer and encapsulates the sensor wire. A cover non-conductive layer is then deposited over portions of the conductive layer to insulate the conductive layer. Portions of the non-conductive layer are then removed such that an area of the conductive layer is exposed to define a sensor area.

Abstract translation: 接近传感器包括支撑在壳体结构的外表面上的引线和从引线延伸并穿过壳结构中的开口的传感器线。 该传感器通过以非固化状态施加交替的导电和非导电材料层来形成。 在非固化状态下，将基底非导电层施加到围绕传感器丝线的壳体结构的内表面。 一旦固化，将导电层沉积在基底非导电层上并封装传感器线。 然后将覆盖非导电层沉积在导电层的部分上以使导电层绝缘。 然后去除非导电层的部分，使得暴露导电层的区域以限定传感器区域。