公开(公告)号：US20050167670A1

公开(公告)日：2005-08-04

申请号：US11036892

申请日：2005-01-14

申请人： Toshikazu Fujimoto ,  Toshiaki Arai ,  Masaya Tanaka

发明人： Toshikazu Fujimoto ,  Toshiaki Arai ,  Masaya Tanaka

IPC分类号： H01L21/768 ,  G02F1/1362 ,  H01L29/04 ,  H01L29/786

CPC分类号： G02F1/136286

摘要： For some embodiments of the present disclosure, an array substrate includes a transparent insulating substrate, a plurality of wires positioned on the transparent insulating substrate, a first insulating film positioned on the transparent insulating substrate and in between the wires, and a second insulating film positioned on the wires and on the first insulating film. By virtue of the first insulating film positioned between the wires, the wires are completely covered by the first insulating film and the second insulating film.

摘要翻译： 对于本公开的一些实施例，阵列基板包括透明绝缘基板，位于透明绝缘基板上的多条导线，位于透明绝缘基板上并位于导线之间的第一绝缘薄膜和位于 在电线和第一绝缘膜上。 由于位于导线之间的第一绝缘膜，导线被第一绝缘膜和第二绝缘膜完全覆盖。

公开(公告)号：US20050224977A1

公开(公告)日：2005-10-13

申请号：US11044716

申请日：2005-01-28

申请人： Yusuke Yoshimura ,  Toshikazu Fujimoto ,  Toshiaki Arai

发明人： Yusuke Yoshimura ,  Toshikazu Fujimoto ,  Toshiaki Arai

IPC分类号： H01L21/44 ,  H01L21/768 ,  H01L29/40 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38

CPC分类号： H01L21/7685 ,  H01L21/76838 ,  H01L21/76852 ,  H05K1/0306 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0317

摘要： The present invention provides a wiring substrate. The wiring substrate includes a substrate, a copper wiring layer, and a diffusing barrier layer. The copper wiring layer is formed above the substrate and is made of copper or a material containing copper as a principal component. The diffusing barrier layer is formed on the copper wiring layer and is made of metal containing nitrogen. Meanwhile a method for manufacturing the wiring substrate is provided.

摘要翻译： 本发明提供一种布线基板。 布线基板包括基板，铜布线层和扩散阻挡层。 铜布线层形成在基板的上方，由铜或以铜为主要成分的材料制成。 扩散阻挡层形成在铜布线层上，由含有氮的金属制成。 同时提供一种制造布线基板的方法。