摘要:
Silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consisting of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical.are prepared by:(a) reacting a bromoaniline compound with a chosen silylating agent to form a compound having the formula BrC.sub.6 H.sub.5 NSi(R.sub.1).sub.3 Si(R.sub.2).sub.3, where R.sub.1 and R.sub.2 are each a C.sub.1 to C.sub.4 alkyl group(b) reacting the compound formed in step "a" with n-butyllithium, followed by reaction with a chosen halogenated alkylsilane compound to form a compound having Formula II ##STR2## where R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are as defined above (c) reacting the compound of Formula II formed in step "b" with a dianhydride compound having the formula ##STR3## where Z is as defined above to form a compound having Formula III ##STR4## where R.sub.3, R.sub.4, and Z are as defined above (d) hydrolyzing the compound of Formula III formed in step "c" to form the compound of Formula I.The compound of Formula I may be polymerized. A preferred copolymer in accordance with the present invention is formed by polymerizing the compound of Formula I with a silicon compound having the formula ##STR5## where R.sub.3 and R.sub.4 are as defined above,X=halogen, OH, OR, NRR, or ureido,R is selected from the group consisting of aC.sub.1This invention was made with United States Government support under Contract No. F33615-86-C-5081 awarded by the Department of the Air Force. The United States Government has certain rights in this invention.
摘要:
[2,2,2-Trifluoro-1-(trifluoromethyl)]ethylidene-bisbenzenethiols are new compounds useful as precursors in the manufacture of polysulfide polymers and copolymers.
摘要:
Polymers of silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consisting of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical.A preferred copolymer in accordance with the present invention is formed by polymerizing the compound of Formula I with a silicon compound having the formula ##STR2## where R.sub.3 and R.sub.4 are as defined above, X=halogen, OH, OR, NRR, or ureido,Y=--O-- or ##STR3## p=1 to 10.
摘要翻译:式I的硅烷醇封端的芳族酰亚胺化合物的聚合物其中R 3和R 4各自选自C 1 -C 6烷基,未取代的芳基和取代的芳基,Z是二价基团 。 根据本发明的优选的共聚物是通过将式I化合物与式(III)的硅化合物聚合而形成的,其中R 3和R 4如上定义,X =卤素,OH,OR,NRR或脲基, Y = -O-或 p = 1〜10。
摘要:
Silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consistsing of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical.are prepared by: (a) reacting a bromoaniline compound with a chosen silylating agent to form a compound having the formula BrC.sub.6 H.sub.5 NSi(R.sub.1).sub.3 Si(R.sub.2).sub.3, where R.sub.1 and R.sub.2 are each a C.sub.1 to C.sub.4 alkyl group(b) reacting the compound formed in step "a" with n-butyllithium, followed by reaction with a chosen halogenated alkylsilane compound to form a compound having Formula II ##STR2## where R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are as defined above (c) reacting the compound of Formula II formed in step "b" with a dianhydride compound having the formula ##STR3## where Z is as defined above to form a compound having Formula III ##STR4## where R.sub.3, R.sub.4, and Z are as defined above (d) hydrolyzing the compound of Formula III formed in step "c" to form the compound of Formula I.The compound of Formula I may be polymerized. A preferred copolymer in accordance with the present invention is formed by polymerizing the compound of Formula I with a silicon compound having the formula ##STR5## where R.sub.3 and R.sub.4 are as defined above,X=halogen, OH, OR, NRR, or ureido,R is selected from the group consisting of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group, and a substituted aryl groupsY=--O-- or ##STR6##This invention was made with United States Government support under Contract No. F336l5-86-C-508l awarded by the Department of the Air Force. The United States Government has certain rights in this invention.
摘要:
Acetylene terminated s-triazine oligomers are disclosed which polymerize into stable high temperature resins. The oligomers of this invention are readily prepared from off-the-shelf starting materials, they are soluble in conventional low boiling solvents and exhibit low melting points which facilitate ease of processing.
摘要:
Multiple layers of a clear insulating material, such as clear polyimide, with horizontal metalization layers therebetween and with vertical feed through metal traces therethrough form a flexible three dimension circuit printed circuit board upon which semiconductor devices, such as thin film solar cell can be directly deposited for forming a flexible electronic module, and upon which electronic discrete component can be bonded and electrically connected. In one exemplar configuration, a flexible thin film solar cell power module has thin film solar cells deposited on one side and power converters bonded on the other for a solar array power system. The flexible printed circuit board is well suited for forming electronic systems about a curved surface such as a power sphere nanosatellite.
摘要:
A flexible inflatable hinge includes curable resin for rigidly positioning panels of solar cells about the hinge in which wrap around contacts and flex circuits are disposed for routing power from the solar cells to the power bus further used for grounding the hinge. An indium tin oxide and magnesium fluoride coating is used to prevent static discharge while being transparent to ultraviolet light that cures the embedded resin after deployment for rigidizing the inflatable hinge.
摘要:
Acetylene terminated s-triazine oligomers are disclosed which polymerize into stable high temperature resins. The oligomers of this invention are readily prepared from off-the-shelf starting materials, they are soluble in conventional low boiling solvents and exhibit low melting points which facilitate ease of processing.