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    Method for connecting solar cells
    1.
    发明授权
    Method for connecting solar cells 有权
    太阳能电池连接方法

    公开(公告)号：US09029689B2

    公开(公告)日：2015-05-12

    申请号：US12978259

    申请日：2010-12-23

    申请人： Thomas Phu ,  Shashwat Kumaria ,  Briccio deLeon

    发明人： Thomas Phu ,  Shashwat Kumaria ,  Briccio deLeon

    IPC分类号： H01L31/02 ,  H01L31/05 ,  H01L31/18

    CPC分类号： H01L31/188 ,  H01L31/0508 ,  Y02E10/50 ,  Y10T29/532

    摘要： A method of connecting two solar cells is disclosed. In one embodiment, the method comprises gripping an interconnect with a head of positioning device, heating the interconnect with the head of the positioning device to between two predetermined temperatures, where one is higher than the other, positioning the interconnect so as to overlay two adjacent solar cells, coupling the interconnect to each of the two adjacent solar cells, and releasing the interconnect from the head.

    摘要翻译： 公开了一种连接两个太阳能电池的方法。 在一个实施例中，该方法包括夹持与定位装置的头部的互连，将与定位装置的头部的互连加热到两个预定温度之间，其中一个高于另一个预定温度，定位互连以覆盖两个相邻 太阳能电池，将互连件耦合到两个相邻太阳能电池中的每一个，并且从头部释放互连。

    Substrate carrier for electroplating solar cells
    9.
    发明授权
    Substrate carrier for electroplating solar cells 有权
    电镀太阳能电池基板载体

    公开(公告)号：US07172184B2

    公开(公告)日：2007-02-06

    申请号：US10912348

    申请日：2004-08-04

    申请人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas H. Rose ,  Thomas Pass

    发明人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas H. Rose ,  Thomas Pass

    IPC分类号： B25B11/02 ,  C25D17/06

    CPC分类号： C25D17/08 ,  H01L21/2885 ,  Y10S269/90

    摘要： A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non-conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame. In use, the carrier can support a high number of units for processing with no significant mechanical stress being transferred to the wafers during loading and unloading from the carrier. The carriers and wafers can be transferred easily for different chemical baths and can be handled safely during rinsing and drying steps.

    摘要翻译： 用于处理多个晶片或其它基板的载体包括其上安装晶片的支撑框架，并且在一个实施例中，至少一个用于将基板保持在支撑框架上的辅助框架。 多个夹子从辅助框架延伸并且以压力接合方式接合基板，并且紧固件将辅助框架相对于支撑框架保持在适当的位置。 在一个实施例中，可以使用两个辅助框架来将晶片保持在支撑框架的相对表面上。 支撑框架具有非导电表面，由此该处理不影响支撑框架，并且辅助框架由非导电材料制成。 在电镀操作期间，夹子是导电的并且桥接电流从支撑框架到晶片。 在另一个实施例中，不使用辅助框架，并且将晶片固定夹安装在支撑框架上。 在使用中，载体可以支撑大量用于加工的单元，在从载体装载和卸载期间，没有明显的机械应力转移到晶片。 载体和晶片可以容易地转移到不同的化学浴中，并且可以在漂洗和干燥步骤期间安全地处理。