公开(公告)号：US20230405884A1

公开(公告)日：2023-12-21

申请号：US18337173

申请日：2023-06-19

申请人： The Texas A&M University System ,  Essentium IPCO, LLC

发明人： Anubhav Sarmah ,  Micah J. Green ,  Smita Shivraj Dasari ,  Daniel Carey ,  Nirup Nagabandi

IPC分类号： B29C35/12 ,  B29C73/12

CPC分类号： B29C35/12 ,  B29C73/12 ,  B29K2063/00

摘要： Provided herein is a method for repairing a composite material, a layup manufacturing process of a composite and a system for manufacturing a 3-dimensional composite part. The method, process and system all utilize a dielectric barrier discharge applicator to generate a plasma to cure an epoxy material to bond a patch to a composite material or to bond two or more layers of composite material together in a 3-dimensional shape to form a composite part.

公开(公告)号：US20240140020A1

公开(公告)日：2024-05-02

申请号：US18384752

申请日：2023-10-27

申请人： The Texas A&M University System ,  Essentium Inc.

发明人： Smita Shivraj Dasari ,  Anubhav Sarmah ,  Aniela Wright ,  Micah J. Green ,  Nirup Nagabandi ,  Daniel Carey

IPC分类号： B29C64/118 ,  B29C70/38 ,  B29C71/00 ,  B33Y10/00 ,  B33Y70/10

CPC分类号： B29C64/118 ,  B29C70/384 ,  B29C71/0081 ,  B33Y10/00 ,  B33Y70/10 ,  B29K2307/04

摘要： An out-of-oven system for free-form fabrication of continuous carbon fiber composites includes a dielectric barrier discharge (DBD) applicator configured to create an electric field proximal to the continuous carbon fiber composite. The DBD applicator includes a first electrode disposed within a dielectric barrier, and a second electrode spaced apart from the first electrode. The first and second electrodes are configured to allow the continuous carbon fiber composite to pass therebetween to cure the continuous carbon fiber composite. The system uses Joule heating to cure the continuous carbon fiber composite.

公开(公告)号：US20230173755A1

公开(公告)日：2023-06-08

申请号：US18072190

申请日：2022-11-30

申请人： The Texas A&M University System

发明人： Anubhav Sarmah ,  Ava Crowley ,  Suchi Desai ,  Gabriel Zolton ,  Micah J. Green

IPC分类号： B29C64/295 ,  B29C64/118 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/10

CPC分类号： B29C64/295 ,  B29C64/118 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/10 ,  B29K2101/10

摘要： In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.