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公开(公告)号:US20230173755A1
公开(公告)日:2023-06-08
申请号:US18072190
申请日:2022-11-30
发明人: Anubhav Sarmah , Ava Crowley , Suchi Desai , Gabriel Zolton , Micah J. Green
IPC分类号: B29C64/295 , B29C64/118 , B33Y10/00 , B33Y30/00 , B33Y70/10
CPC分类号: B29C64/295 , B29C64/118 , B33Y10/00 , B33Y30/00 , B33Y70/10 , B29K2101/10
摘要: In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.