Abstract:
A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.
Abstract:
A surface acoustic wave device has a supporting substrate 1, a propagation substrate 3A made of a piezoelectric single crystal, an organic adhesive layer 2 having a thickness of 0.1 to 1.0 μm and bonding the supporting substrate 1 and the propagation substrate 3, and a surface acoustic wave filter provided on the propagation substrate 3A.
Abstract:
A wavelength conversion device 1 has a supporting body 8, a wavelength conversion substrate 2, a lower side buffer layer 6 provided on the side of a bottom face 2b of the substrate 2, a upper side buffer layer 9 provided on the side of a upper face 2a of the substrate 2, and an adhesive layer 7 adhering the supporting body 8 and the lower side buffer layer 6. The wavelength conversion substrate 2 is made of a Z-plate of a ferroelectric single crystal and a periodic polarization inversion structure 5 formed therein. The supporting body 8 has a volume resistivity lower than that of the ferroelectric single crystal of the wavelength conversion substrate 2.
Abstract:
A wavelength conversion device 1 includes a supporting body 8, a wavelength conversion substrate 2 of a Z-plate of a ferroelectric single crystal with a periodic domain inversion structure 5 formed therein and having a thickness “T” of 10 μm or more and 100 μm or less, a buffer layer 6 provided on a bottom face 2b of the wavelength conversion substrate 2, and an organic resin adhesive layer 7 adhering the supporting body 8 and buffer layer 6 with a thickness of 0.6 μm or more and 2.0 μm or less.
Abstract:
A cladding layer 7 is formed on a base body made of a material for an optical waveguide, and a groove is formed in the base body and the cladding layer 7. The base body and the cladding layer are joined to a supporting substrate with the cladding layer 7 positioned on the said of the supporting substrate 1. The base body is machined and thinned to form a thin plate 30 so that the groove penetrates through the thin plate 30. An end face 14A on the groove 12 side of the optical waveguide 13A is contacted with a light absorbing material or light reflecting material 9 to form a reflecting mirror.
Abstract:
A wavelength conversion device 1 has a supporting substrate 2, a wavelength conversion element 17 provided on the supporting substrate 2, separate portions 18, 19 provided on both sides of the wavelength conversion element 17, respectively, and separated from the wavelength conversion element 17, and an adhesive layer 3 bonding the supporting substrate 2 and the wavelength conversion element 17 and bonding the supporting substrate 2 and the separate portions 18, 19. The element 17 and separate portions 18, 19 are made of ferroelectric materials, respectively. The wavelength conversion element 17 has a ridge optical waveguide 17c, grooves 8 provided on both sides of the ridge optical waveguide 17, respectively, and extended portions 17a provided on the outside of the grooves 8, respectively.
Abstract:
A harmonic wave oscillating system includes a solid-state laser oscillator, a converting waveguide converting a wavelength of a laser light oscillated from the solid-state laser oscillator to oscillate a harmonic wave, an incident-side end face of the laser light, an emitting-side end face of the harmonic wave, a first side face and a second side face. The emitting-side end face includes a polished surface 6 formed on the side of the first side face 1a and a light scattering surface formed on the side of the second side face 1b. The first side face 1a and polished surface 6 are intersected at an obtuse angle θ, and the second side face 1b and light scattering surface 5 are intersected at an obtuse or right angle α.
Abstract:
A liquid crystal composition having a nematic phase that includes two components, wherein the first component is a specific four-membered ring compound having a large maximum temperature, and the second component is a specific four-membered ring compound having a large dielectric anisotropy and a large optical anisotropy, and a liquid crystal display device containing the composition.
Abstract:
A voltage is applied on an interdigitated electrode provided on one main face of a single-domain ferroelectric single crystal substrate to form a periodic domain inversion structure 9. The interdigitated electrode is then removed. The optical waveguide 20 is then formed in the substrate 18. An optical intensity center P1 of the optical waveguide is kept away from a location P0 of the end of the interdigitated electrode.
Abstract:
A voltage is applied on an interdigitated electrode provided on one main face 8a of a single-domain ferroelectric single crystal substrate 8 to form a periodic domain inversion structure 29, the interdigitated electrode is removed and the one main face 8a of the substrate 8 is machined to remove the surface region 25 of the substrate 8 to form a machined surface. The optical waveguide is then formed in the substrate 8.