专利检索 ap:("Takami OTSUKI" OR "Taichi OBARA" OR "Akira GOTO") AND inv:"Takami OTSUKI" 第 1 页

1.

发明申请
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF 审中-公开

公开(公告)号：US20130082283A1

公开(公告)日：2013-04-04

申请号：US13473991

申请日：2012-05-17

申请人： Takami OTSUKI , Taichi OBARA , Akira GOTO

发明人： Takami OTSUKI , Taichi OBARA , Akira GOTO

IPC分类号： H01L29/16 , H01L29/02 , H01L21/768 , H01L23/48

CPC分类号： H01L21/4821 , B22D19/00 , B22D21/04 , H01L23/24 , H01L23/3121 , H01L23/3735 , H01L23/49811 , H01L24/32 , H01L24/48 , H01L24/49 , H01L25/162 , H01L25/50 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/45099

摘要： A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.