公开(公告)号：US20240096781A1

公开(公告)日：2024-03-21

申请号：US18186209

申请日：2023-03-20

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chun-Ti Lu ,  Hao-Yi Tsai ,  Chia-Hung Liu ,  Yu-Hsiang Hu ,  Hsiu-Jen Lin ,  Tzuan-Horng Liu ,  Chih-Hao Chang ,  Bo-Jiun Lin ,  Shih-Wei Chen ,  Hung-Chun Cho ,  Pei-Rong Ni ,  Hsin-Wei Huang ,  Zheng-Gang Tsai ,  Tai-You Liu ,  Po-Chang Shih ,  Yu-Ting Huang

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H10B80/00

CPC分类号： H01L23/49894 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.