-
公开(公告)号:US11916023B2
公开(公告)日:2024-02-27
申请号:US17012255
申请日:2020-09-04
发明人: Sung-Hui Huang , Da-Cyuan Yu , Kuan-Yu Huang , Pai Yuan Li , Hsiang-Fan Lee
IPC分类号: H01L21/56 , H01L21/48 , H01L23/00 , H01L23/31 , H01L23/367 , H01L23/373 , H01L23/498 , H01L25/00 , H01L25/065 , H01L25/18
CPC分类号: H01L23/562 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/4882 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/3733 , H01L23/3736 , H01L23/3737 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L25/18 , H01L25/50 , H01L23/367 , H01L24/16 , H01L24/73 , H01L24/97 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83385 , H01L2224/83951 , H01L2224/92225 , H01L2924/00014 , H01L2924/10158 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/165 , H01L2924/181 , H01L2924/18161 , H01L2924/35121 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00012 , H01L2924/181 , H01L2924/00012 , H01L2924/15311 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00012 , H01L2924/00014 , H01L2224/13099
摘要: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
-
公开(公告)号:US20240162166A1
公开(公告)日:2024-05-16
申请号:US18422550
申请日:2024-01-25
发明人: Sung-Hui Huang , Da-Cyuan Yu , Kuan-Yu Huang , Pai Yuan Li , Hsiang-Fan Lee
IPC分类号: H01L23/00 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/373 , H01L23/498 , H01L25/00 , H01L25/065 , H01L25/18
CPC分类号: H01L23/562 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/4882 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/3733 , H01L23/3736 , H01L23/3737 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L25/18 , H01L25/50 , H01L23/367 , H01L24/16 , H01L24/73 , H01L24/97 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83385 , H01L2224/83951 , H01L2224/92225 , H01L2924/00014 , H01L2924/10158 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/165 , H01L2924/181 , H01L2924/18161 , H01L2924/35121
摘要: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
-