-
公开(公告)号：US11764081B2
公开(公告)日：2023-09-19
申请号：US17350036
申请日：2021-06-17
发明人： Jieh-Chau Huang , Bi-Ming Yen , Hung-Lung Hu , Ying Ting Hsia , Ping-Jung Huang , Pei Yen Hsia
IPC分类号： H01L21/67 , H01L21/673 , H01L21/687
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/67248 , H01L21/67253 , H01L21/67288 , H01L21/67393 , H01L21/6875 , H01L21/68728
摘要： The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
-
公开(公告)号：US11056358B2
公开(公告)日：2021-07-06
申请号：US16100635
申请日：2018-08-10
发明人： Jieh-Chau Huang , Bi-Ming Yen , Hung-Lung Hu , Ying Ting Hsia , Ping-Jung Huang , Pei Yen Hsia
IPC分类号： H01L21/67 , H01L21/673 , H01L21/687
摘要： The present disclosure describes an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
-
公开(公告)号：US09515021B1
公开(公告)日：2016-12-06
申请号：US14887952
申请日：2015-10-20
发明人： Yu-Chih Chen , Hung-Lung Hu , Chia-Ching Tsai , Szu-Hung Yang
IPC分类号： H01L21/30 , H01L23/528 , H01L23/532 , H01L23/535 , H01L21/768 , H01L21/3115
CPC分类号： H01L21/3115 , H01L21/0276 , H01L21/31116 , H01L21/31144 , H01L21/76802 , H01L21/76823 , H01L21/76832 , H01L21/76834 , H01L23/53214 , H01L23/53228 , H01L23/53242 , H01L23/53257 , H01L23/53295
摘要： A semiconductor device with metal-doped etch stop layer therein and a method of manufacturing the same is disclosed. The method includes forming an semiconductor device with a interconnect structure that has a dielectric layer and a conductor therein, and an etch stop layer over the dielectric layer; applying a photo resist layer and patterning the photo resist layer to expose a portion of the etch stop layer on a top surface of the conductor over of the dielectric layer; and doping the exposed portion of the etch stop layer with an element to form a metal-doped etch stop layer. The formed metal-doped etch stop layer has a recess structure and functions as a conductive pad over the conductor.
摘要翻译： 公开了一种其中具有金属掺杂蚀刻停止层的半导体器件及其制造方法。 该方法包括形成具有介电层和导体的互连结构的半导体器件，以及在该介电层上的蚀刻停止层; 施加光致抗蚀剂层并图案化光致抗蚀剂层以暴露介电层上导体顶表面上的一部分蚀刻停止层; 以及用元件掺杂蚀刻停止层的暴露部分以形成金属掺杂的蚀刻停止层。 所形成的金属掺杂蚀刻停止层具有凹陷结构并且用作导体上的导电焊盘。
-
公开(公告)号：US20240021446A1
公开(公告)日：2024-01-18
申请号：US18362271
申请日：2023-07-31
发明人： Jieh-Chau HUANG , Ying Ting Hsia , Ping-Jung Huang , Pei Yen Hsia , Bi-Ming Yen , Hung-Lung Hu
IPC分类号： H01L21/67 , H01L21/673 , H01L21/687
CPC分类号： H01L21/67051 , H01L21/67288 , H01L21/67393 , H01L21/67253 , H01L21/6875 , H01L21/67248 , H01L21/68728 , H01L21/6719
摘要： The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.
-
-
-
搜索结果
4 条记录 (耗时 0.018 秒)
