公开(公告)号：US20240021446A1

公开(公告)日：2024-01-18

申请号：US18362271

申请日：2023-07-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Jieh-Chau HUANG ,  Ying Ting Hsia ,  Ping-Jung Huang ,  Pei Yen Hsia ,  Bi-Ming Yen ,  Hung-Lung Hu

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/67288 ,  H01L21/67393 ,  H01L21/67253 ,  H01L21/6875 ,  H01L21/67248 ,  H01L21/68728 ,  H01L21/6719

摘要： The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.

公开(公告)号：US11764081B2

公开(公告)日：2023-09-19

申请号：US17350036

申请日：2021-06-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Jieh-Chau Huang ,  Bi-Ming Yen ,  Hung-Lung Hu ,  Ying Ting Hsia ,  Ping-Jung Huang ,  Pei Yen Hsia

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/6719 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/67393 ,  H01L21/6875 ,  H01L21/68728

摘要： The present disclosure relates to an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.

公开(公告)号：US11056358B2

公开(公告)日：2021-07-06

申请号：US16100635

申请日：2018-08-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Jieh-Chau Huang ,  Bi-Ming Yen ,  Hung-Lung Hu ,  Ying Ting Hsia ,  Ping-Jung Huang ,  Pei Yen Hsia

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/687

摘要： The present disclosure describes an apparatus for wafer cleaning. The apparatus includes an enclosure made of a noncombustible material, a wafer holder, a cleaning nozzle, at least one sensor, and an exhaust unit. The wafer holder can hold and heat a wafer. The cleaning nozzle can supply a flow of a cleaning fluid onto a surface of the wafer. The at least one sensor can detect attributes of the wafer. The exhaust unit can expel a vapor generated by the cleaning fluid in the enclosure. The exhaust unit can include a rinse nozzle to rinse the vapor passing through the exhaust unit with a mist.