公开(公告)号：US20220310678A1

公开(公告)日：2022-09-29

申请号：US17353003

申请日：2021-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sheng-Chan Li ,  Hau-Yi Hsiao ,  Che Wei Yang ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: H01L27/146 ,  H01L21/768

Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a semiconductor substrate comprising a front-side surface opposite a back-side surface. A plurality of photodetectors is disposed in the semiconductor substrate. An isolation structure extends into the back-side surface of the semiconductor substrate and is disposed between adjacent photodetectors. The isolation structure includes a metal core, a conductive liner disposed between the semiconductor substrate and the metal core, and a first dielectric liner disposed between the conductive liner and the semiconductor substrate. The metal core comprises a first metal material and the conductive liner comprises the first metal material and a second metal material different from the first metal material.

公开(公告)号：US20220362887A1

公开(公告)日：2022-11-17

申请号：US17317977

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Ming Wu ,  Yung-Lung Lin ,  Hau-Yi Hsiao ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: B23K26/361 ,  H01L21/02 ,  B23K26/062 ,  B23K26/035 ,  H01L21/66

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

公开(公告)号：US11951569B2

公开(公告)日：2024-04-09

申请号：US17317977

申请日：2021-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Ming Wu ,  Yung-Lung Lin ,  Hau-Yi Hsiao ,  Sheng-Chau Chen ,  Cheng-Yuan Tsai

IPC: H01L21/02 ,  B23K26/035 ,  B23K26/062 ,  B23K26/361 ,  H01L21/66

CPC classification number: B23K26/361 ,  B23K26/035 ,  B23K26/062 ,  H01L21/02021 ,  H01L22/10

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

公开(公告)号：US11127635B1

公开(公告)日：2021-09-21

申请号：US16866685

申请日：2020-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Lung Lin ,  Cheng-Hsien Chou ,  Cheng-Yuan Tsai ,  Kuo-Ming Wu ,  Hau-Yi Hsiao

IPC: H01L21/822 ,  H01L21/304 ,  H01L29/06 ,  H01L27/06

Abstract: The present disclosure relates to a method for forming a multi-dimensional integrated chip structure. In some embodiments, the method may be performed by bonding a second substrate to an upper surface of a first substrate. A first edge trimming cut is performed along a first loop and extends into a first peripheral portion of the second substrate. A second edge trimming cut is performed along a second loop and extends into a second peripheral portion of the second substrate and into the first substrate. A third edge trimming cut is performed along a third loop and extends into a third peripheral portion of the first substrate.