知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

9 条记录 (耗时 0.032 秒)

    Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method
    2.
    发明授权
    Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method 有权
    化学机械抛光水性分散体，其制备方法，化学机械抛光水分散体制备试剂盒和化学机械抛光方法

    公开(公告)号：US08480920B2

    公开(公告)日：2013-07-09

    申请号：US12749934

    申请日：2010-03-30

    申请人： Hirotaka Shida ,  Akihiro Takemura ,  Taichi Abe

    发明人： Hirotaka Shida ,  Akihiro Takemura ,  Taichi Abe

    IPC分类号： C09G1/02 ,  H01L21/3212

    CPC分类号： C09K3/1463 ,  C09K3/1409

    摘要： A chemical mechanical polishing aqueous dispersion that is used to polish a polishing target that includes a wiring layer that contains tungsten, the chemical mechanical polishing aqueous dispersion including: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica having an average particle diameter calculated from a specific surface area determined by the BET method of 10 to 60 nm, the content (MA) (mass %) of the cationic water-soluble polymer (A) and the content (MC) (mass %) of the colloidal silica (C) satisfying the relationship “MA/MC=0.0001 to 0.003”, and the chemical mechanical polishing aqueous dispersion having a pH of 1 to 3.

    摘要翻译： 一种化学机械抛光水性分散体，其用于抛光包括含有钨的布线层的抛光对象，所述化学机械抛光水分散体包括：（A）阳离子水溶性聚合物; （B）铁（III）化合物; 和（C）由BET法测定的比表面积为10〜60nm，阳离子型水溶性聚合物（A）的含量（质量％）（质量％）和含量 （C）的胶体二氧化硅（C）的质量％（MC）（质量％），pH为1〜3的化学机械研磨用水系分散体。

    CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, METHOD OF PREPARING THE SAME, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND CHEMICAL MECHANICAL POLISHING METHOD
    3.
    发明申请
    CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, METHOD OF PREPARING THE SAME, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND CHEMICAL MECHANICAL POLISHING METHOD 有权
    化学机械抛光水性分散体，其制备方法，化学机械抛光水溶液制备试剂盒和化学机械抛光方法

    公开(公告)号：US20100252774A1

    公开(公告)日：2010-10-07

    申请号：US12749934

    申请日：2010-03-30

    申请人： Hirotaka SHIDA ,  Akihiro Takemura ,  Taichi Abe

    发明人： Hirotaka SHIDA ,  Akihiro Takemura ,  Taichi Abe

    IPC分类号： C09K13/00

    CPC分类号： C09K3/1463 ,  C09K3/1409

    摘要： A chemical mechanical polishing aqueous dispersion that is used to polish a polishing target that includes a wiring layer that contains tungsten, the chemical mechanical polishing aqueous dispersion including: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica having an average particle diameter calculated from a specific surface area determined by the BET method of 10 to 60 nm, the content (MA) (mass %) of the cationic water-soluble polymer (A) and the content (MC) (mass %) of the colloidal silica (C) satisfying the relationship “MA/MC=0.0001 to 0.003”, and the chemical mechanical polishing aqueous dispersion having a pH of 1 to 3.

    摘要翻译： 一种化学机械抛光水性分散体，其用于抛光包括含有钨的布线层的抛光对象，所述化学机械抛光水分散体包括：（A）阳离子水溶性聚合物; （B）铁（III）化合物; 和（C）由BET法测定的比表面积为10〜60nm，阳离子型水溶性聚合物（A）的含量（质量％）（质量％）和含量 （C）的胶体二氧化硅（C）的质量％（MC）（质量％），pH为1〜3的化学机械研磨用水系分散体。

    Process for preparing sulfonamide-containing indole compounds
    7.
    发明申请
    Process for preparing sulfonamide-containing indole compounds 审中-公开
    制备含磺酰胺的吲哚化合物的方法

    公开(公告)号：US20070037854A1

    公开(公告)日：2007-02-15

    申请号：US10571285

    申请日：2004-09-01

    申请人： Kenji Hayashi ,  Taichi Abe ,  Naoki Ozeki ,  Hiroshi Akamatsu

    发明人： Kenji Hayashi ,  Taichi Abe ,  Naoki Ozeki ,  Hiroshi Akamatsu

    IPC分类号： A61K31/4439 ,  A61K31/404 ,  C07D403/02 ,  C07D209/18

    CPC分类号： C07D209/42

    摘要： A process for preparing a compound (5a) represented by the following formula: wherein R1 and R2 each independently represent hydrogen, C1-4 alkyl, etc. and A represents cyanophenyl, etc., characterized by reacting a compound (3a) represented by the following formula: wherein R1 and R2 have the same definitions as above, with a compound represented by the formula A—SO2Cl, wherein A has the same definition as above, in the presence of a base, in a mixed solvent of water and C1-6 alkyl acetate.

    摘要翻译： 制备由下式表示的化合物（5a）的方法：其中R 1和R 2各自独立地表示氢，C 1-4 >烷基等，A表示氰基苯基等，其特征在于使由下式表示的化合物（3a）与其中R 1和R 2相同 与式A-SO 2 Cl表示的化合物，其中A在碱存在下，在水和C 1-6烷基乙酸酯。

    PROCESS FOR PRODUCTION OF LIPID A ANALOGUE
    9.
    发明申请
    PROCESS FOR PRODUCTION OF LIPID A ANALOGUE 审中-公开
    生产脂类似物的方法

    公开(公告)号：US20090149647A1

    公开(公告)日：2009-06-11

    申请号：US12064450

    申请日：2006-08-29

    申请人： Katsuya Tagami ,  Keizo Sato ,  Kimihiro Matsuo ,  Taichi Abe ,  Toyokazu Haga

    发明人： Katsuya Tagami ,  Keizo Sato ,  Kimihiro Matsuo ,  Taichi Abe ,  Toyokazu Haga

    IPC分类号： C07H1/00

    CPC分类号： C07H15/04 ,  C07H1/02

    摘要： Discloses is a process for producing α-D-glucopyranose, 3-O-decyl-2-deoxy-6-O-[2-deoxy-3-O-[(3R)-3-methoxydecyl]-6-O-methyl-2-[(11Z)-1-oxo-11-octadecenyl]amino]-4-O-phosphono-β-D-glucopyranosyl]-2-[(1,3-dioxotetradecyl)amino]- or 1-(dihydrogen phosphate) tetrasodium salt which is useful as an active ingredient of a pharmaceutical or an intermediate for the synthesis thereof, which is environment-friendly and excellent in safety, operationality and reproducibility. A process for producing a compound represented by the formula (I) comprising the steps of reacting a compound represented by the formula (VIII) with a palladium catalyst in the presence of a nucleopholic agent and treating the product with a sodium source.

    摘要翻译： 公开了制备α-D-吡喃葡萄糖，3-O-癸基-2-脱氧-6-O- [2-脱氧-3-O - [（3R）-3-甲氧基癸基] -6-O-甲基 -2 - [（11Z）-1-氧代-11-十八碳烯基]氨基] -4-O-膦酰基-β-D-吡喃葡萄糖基] -2 - [（1,3-二氧代十四烷基）氨基] - 或1- 磷酸盐）四钠盐，其可用作其合成的药物或中间体的活性成分，其环境友好并且安全性，操作性和再现性优异。 一种制备由式（I）表示的化合物的方法，包括以下步骤：使式（VIII）表示的化合物与钯催化剂在一种核仁类药剂的存在下反应并用钠源处理该产物。