AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, PRODUCTION METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD
    3.
    发明申请
    AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, PRODUCTION METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD 审中-公开
    化学机械抛光水性分散体及其生产方法及化学机械抛光方法

    公开(公告)号:US20090325323A1

    公开(公告)日:2009-12-31

    申请号:US12373897

    申请日:2007-07-11

    IPC分类号: C09G1/02 H01L21/304 C09K13/00

    摘要: There is provided an aqueous dispersion for chemical mechanical polishing that comprises abrasives comprising: (A) 100 parts by weight of inorganic particles comprising ceria, (B) 5 to 100 parts by weight of cationic organic polymer particles, and (C) 5 to 120 parts by weight of anionic water-soluble compound. The aqueous dispersion for chemical mechanical polishing is preferably produced by a method comprising a step of adding a second liquid comprising (C) 5 to 30 wt % of anionic water-soluble compound to a first liquid comprising (A) 0.1 to 10 wt % of inorganic particles comprising ceria and (B) 5 to 100 parts by weight of cationic organic polymer particles based on 100 parts by weight of the inorganic particles (A).

    摘要翻译: 提供了一种用于化学机械抛光的水性分散体,其包括研磨剂,其包含:(A)100重量份的包含二氧化铈的无机颗粒,(B)5至100重量份的阳离子有机聚合物颗粒,和(C)5至120 重量份的阴离子水溶性化合物。 用于化学机械抛光的水性分散体优选通过包括以下步骤的方法来制备:将包含(C)5至30重量%的阴离子水溶性化合物的第二液体添加到第一液体中的步骤,所述第一液体包含(A)0.1至10重量% 包含二氧化铈的无机颗粒和(B)基于100重量份的无机颗粒(A)的5至100重量份的阳离子有机聚合物颗粒。