-
公开(公告)号：US10449713B2
公开(公告)日：2019-10-22
申请号：US15005436
申请日：2016-01-25
Applicant: TYCO ELECTRONICS CORPORATION
Inventor： Ranjan Deepak Deshmukh , Jessica H. B. Hemond
IPC: B29C64/118 , B29C71/00 , B33Y70/00 , B29C64/106 , B29C64/40 , B29C33/52 , B33Y10/00 , B33Y40/00 , B33Y80/00 , B29K101/12 , B29K279/00 , B29K81/00
Abstract: An article and a method of forming an article are provided. The article includes a thermoplastic build material and a polymeric support material. The polymeric support material is selectively removable from the thermoplastic build material through immersion in a solvent. The method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively softening the polymeric support material with the solvent, removing the part from the solvent, and separating the polymeric support material from the thermoplastic build material. Another method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively dissolving the polymeric support material with the solvent, and removing the thermoplastic build material from the solvent.
-
2.发明申请公开(公告)号：US20170236610A1
公开(公告)日：2017-08-17
申请号：US15043468
申请日：2016-02-12
Applicant: Tyco Electronics Corporation
Inventor： Yiliang Wu , Barry C. Mathews , Miguel A. Morales , Leonard Henry Radzilowski , Michael A. Oar , Ranjan Deepak Deshmukh , James Paul Scholz , Bruce Foster Bishop , Jerry L. Moore
IPC: H01B1/02 , C09D11/037 , H01B13/00 , C09D11/52
CPC classification number: H01B1/02 , B82Y30/00 , C08G77/26 , C08K2003/0806 , C09D4/00 , C09D5/002 , C09D5/24 , C09D7/61 , C09D11/03 , C09D11/037 , C09D11/52 , C09D183/08 , H01B1/22 , H01B13/0026 , H05K1/097 , H05K3/1283 , H05K3/389 , H05K2203/1131 , C08K3/08 , C08L83/08 , C08K9/06
Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.
-
公开(公告)号：US20170210079A1
公开(公告)日：2017-07-27
申请号：US15005436
申请日：2016-01-25
Applicant: TYCO ELECTRONICS CORPORATION
Inventor： Ranjan Deepak Deshmukh , Jessica H.B. Hemond
CPC classification number: B29C64/118 , B29C33/52 , B29C64/106 , B29C64/40 , B29C71/0009 , B29C2071/0027 , B29K2081/06 , B29K2101/12 , B29K2279/085 , B29K2879/085 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00
Abstract: An article and a method of forming an article are provided. The article includes a thermoplastic build material and a polymeric support material. The polymeric support material is selectively removable from the thermoplastic build material through immersion in a solvent. The method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively softening the polymeric support material with the solvent, removing the part from the solvent, and separating the polymeric support material from the thermoplastic build material. Another method of forming an article includes forming a part through additive manufacturing with a thermoplastic build material and a polymeric support material, immersing the part in a solvent, selectively dissolving the polymeric support material with the solvent, and removing the thermoplastic build material from the solvent.
-
-
Search Results
3
records
(took 0.011 seconds)
