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    Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low Temperature
    1.
    发明申请
    Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low Temperature 审中-公开

    公开(公告)号:US20170238425A1

    公开(公告)日:2017-08-17

    申请号:US15043473

    申请日:2016-02-12

    申请人: Tyco Electronics Corporation

    发明人: Barry C. Mathews ,  Yiliang Wu ,  Miguel A. Morales ,  Michael A. Oar ,  Leonard Henry Radzilowski ,  Juliana B. De Guzman

    IPC分类号: H05K3/22

    CPC分类号: H05K3/22 ,  C09D11/52 ,  H05K1/097 ,  H05K3/12 ,  H05K3/1283 ,  H05K2203/088 ,  H05K2203/1131

    摘要: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.

    Method for Enhancing Adhesion of Silver Nanoparticle Inks Using a Functionalized Alkoxysilane Additive and Primer Layer
    2.
    发明申请
    Method for Enhancing Adhesion of Silver Nanoparticle Inks Using a Functionalized Alkoxysilane Additive and Primer Layer 审中-公开

    公开(公告)号:US20170236610A1

    公开(公告)日:2017-08-17

    申请号:US15043468

    申请日:2016-02-12

    申请人: Tyco Electronics Corporation

    发明人: Yiliang Wu ,  Barry C. Mathews ,  Miguel A. Morales ,  Leonard Henry Radzilowski ,  Michael A. Oar ,  Ranjan Deepak Deshmukh ,  James Paul Scholz ,  Bruce Foster Bishop ,  Jerry L. Moore

    IPC分类号: H01B1/02 ,  C09D11/037 ,  H01B13/00 ,  C09D11/52

    CPC分类号: H01B1/02 ,  B82Y30/00 ,  C08G77/26 ,  C08K2003/0806 ,  C09D4/00 ,  C09D5/002 ,  C09D5/24 ,  C09D7/61 ,  C09D11/03 ,  C09D11/037 ,  C09D11/52 ,  C09D183/08 ,  H01B1/22 ,  H01B13/0026 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/389 ,  H05K2203/1131 ,  C08K3/08 ,  C08L83/08 ,  C08K9/06

    摘要: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

    Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer Layer
    3.
    发明申请
    Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer Layer 审中-公开

    公开(公告)号:US20170233541A1

    公开(公告)日:2017-08-17

    申请号:US15043460

    申请日:2016-02-12

    申请人: Tyco Electronics Corporation

    发明人: Yiliang Wu ,  Barry C. Mathews ,  Michael A. Oar ,  Miguel A. Morales ,  Leonard Henry Radzilowski ,  James Paul Scholz ,  Bruce Foster Bishop ,  Jerry L. Moore

    IPC分类号: C08J7/04 ,  C23C4/129 ,  B05D1/00 ,  B05D1/30 ,  B05D1/02 ,  B05D1/18

    CPC分类号: C08J7/045 ,  B05D1/005 ,  B05D1/02 ,  B05D1/18 ,  B05D1/30 ,  B05D3/0254 ,  B05D3/144 ,  B05D5/12 ,  B05D7/02 ,  B05D7/546 ,  C08J2369/00 ,  C08J2429/04 ,  C08J2429/14 ,  C09D5/002 ,  C09D11/037 ,  C09D11/106 ,  C09D11/52 ,  C09D129/14 ,  C23C4/129 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K3/125 ,  H05K3/386 ,  H05K2203/1131

    摘要: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.

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