公开(公告)号：US20230147650A1

公开(公告)日：2023-05-11

申请号：US17984032

申请日：2022-11-09

申请人： TSE CO., LTD

发明人： Byeong Yong LEE ,  Eun Ha PARK ,  Weon Bin JANG ,  Gun Won SEO ,  Kum Sun PARK ,  Chung Hyeon KIM

IPC分类号： H05K3/42 ,  H05K3/26

CPC分类号： H05K3/424 ,  H05K3/429 ,  H05K3/26 ,  H05K2203/0502 ,  H05K2203/0415 ,  H05K2203/0723 ,  H05K2203/0588

摘要： A method for manufacturing a multi-layer circuit board including an extreme fine via according to an embodiment of the disclosure may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

公开(公告)号：US20220386478A1

公开(公告)日：2022-12-01

申请号：US17556310

申请日：2021-12-20

申请人： TSE CO., LTD

发明人： Eun Ha PARK ,  Sang Wook YOUN ,  Young Jun KIM ,  Yu Jin CHOI ,  Kum Sun PARK ,  Chung Hyeon KIM

IPC分类号： H05K3/46 ,  H05K1/03 ,  H05K3/00

摘要： A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening.
A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.