公开(公告)号：US20240014047A1

公开(公告)日：2024-01-11

申请号：US18371256

申请日：2023-09-21

Applicant: TOPPAN INC.

Inventor： Yuki UMEMURA ,  Takehisa TAKADA ,  Tomoyuki ISHII

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/544 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/00

CPC classification number: H01L21/486 ,  H01L28/40 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/544 ,  H05K1/181 ,  H05K1/115 ,  H05K1/0266 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/0026 ,  H01L2223/54426 ,  H05K2203/107

Abstract: A method for manufacturing a wiring board, including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface to an opposite surface of the glass substrate; a step B of forming a first surface wiring layer including a MIM capacitor on the first surface of the glass substrate; a step C of performing an etching process on a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate opposite to the first surface; and a step D of forming a through electrode in the through via and forming, on the second surface, a second surface wiring layer that is connected to the first surface wiring layer via the through electrode.

公开(公告)号：US20230240009A1

公开(公告)日：2023-07-27

申请号：US18127295

申请日：2023-03-28

Applicant: TOPPAN INC.

Inventor： Takeshi TAKADA ,  Yuki UMEMURA

IPC: H05K1/09 ,  H05K3/42

CPC classification number: H05K1/09 ,  H05K3/42 ,  H05K2201/0137 ,  H05K2203/072 ,  H05K3/46

Abstract: A wiring board includes a first wiring layer disposed on the first adhesion layer; and a second wiring layer disposed on the second adhesion layer, wherein a proportion of copper remaining in the first wiring layer is represented by C=B/A (%), where A is a total area of the first wiring layer, B is an area of copper in the first wiring layer, and C is a remaining copper ratio C defined as the proportion of copper remaining in the first wiring layer, and wherein when the remaining copper ratio C is set to 70 to 100%, the first adhesion layer is comprised of at least one material having a first predetermined Young's modulus, and the first wiring layer is comprised of at least one material having a second predetermined Young's modulus, the first predetermined Young's modulus being 0.1 to 0.85 times the second predetermined Young's modulus.

公开(公告)号：US20240021439A1

公开(公告)日：2024-01-18

申请号：US18371268

申请日：2023-09-21

Applicant: TOPPAN INC.

Inventor： Tomoyuki ISHII ,  Takehisa TAKADA ,  Yuki UMEMURA

IPC: H01L21/48 ,  H01L25/16 ,  H01L23/498 ,  H01L27/01

CPC classification number: H01L21/486 ,  H01L25/16 ,  H01L23/49827 ,  H01L27/01 ,  H01L24/16

Abstract: A wiring board manufacturing method including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface toward an opposite surface thereof; a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer; a step C of etching a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate, the second surface being an opposite surface to the first surface; a through via treatment step D of removing an etching residue of glass adhered to the hydrofluoric acid resistant metal film; and a step E of forming a through electrode in the through via.