公开(公告)号：US20230253277A1

公开(公告)日：2023-08-10

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/14

CPC classification number: H01L23/31 ,  H01L25/0655 ,  H01L21/565 ,  H01L23/564 ,  H01L23/293 ,  H01L23/142

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20210313241A1

公开(公告)日：2021-10-07

申请号：US17220782

申请日：2021-04-01

Applicant: Texas Instruments Incorporated

Inventor： Steven Alfred KUMMERL ,  Benjamin Stassen COOK

IPC: H01L23/14 ,  H01L21/48 ,  H01L21/78 ,  H01L23/498

Abstract: A method for forming a semiconductor structure includes curing a shape memory polymer in a first shape. The shape memory polymer is coupled to a conductive layer. The method further includes folding the shape memory polymer from the first shape into a second shape. The method also includes bonding a semiconductor wafer to the conductive layer while the shape memory polymer is in the second shape. The semiconductor wafer has first and second dies. The semiconductor wafer is then singulated to separate the first die from the second die. The method further includes expanding the shape memory polymer to its first shape and singulating the shape memory polymer to separate the first and second dies.

公开(公告)号：US20230093214A1

公开(公告)日：2023-03-23

申请号：US18059473

申请日：2022-11-29

Applicant: Texas Instruments Incorporated

Inventor： Steven Alfred KUMMERL ,  Benjamin Stassen COOK

IPC: H01L23/14 ,  H01L21/48 ,  H01L23/498 ,  H01L21/78

Abstract: An integrated circuit comprises a substrate including a shape memory polymer, and a semiconductor die mounted on the substrate.

公开(公告)号：US20200211959A1

公开(公告)日：2020-07-02

申请号：US16232684

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin HOU ,  Steven Alfred KUMMERL ,  Roberto Giampiero MASSOLINI ,  Joyce Marie MULLENIX

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/29

Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

公开(公告)号：US20230395472A1

公开(公告)日：2023-12-07

申请号：US18453999

申请日：2023-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/565 ,  H01L21/4821 ,  H01L23/49503 ,  H01L23/3107

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to th first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US20190355652A1

公开(公告)日：2019-11-21

申请号：US16206640

申请日：2018-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US20190326131A1

公开(公告)日：2019-10-24

申请号：US16459184

申请日：2019-07-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20190206699A1

公开(公告)日：2019-07-04

申请号：US15857988

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L23/49517 ,  H01L23/49548

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20220181224A1

公开(公告)日：2022-06-09

申请号：US17116963

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/14 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20210375640A1

公开(公告)日：2021-12-02

申请号：US17401057

申请日：2021-08-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/62 ,  H01L23/00

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.