公开(公告)号：US20230063262A1

公开(公告)日：2023-03-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao LIN ,  Hung-Yu CHOU ,  Bo-Hsun PAN ,  Dong-Ren PENG ,  Pi-Chiang HUANG ,  Yuh-Harng CHIEN

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

公开(公告)号：US20210118779A1

公开(公告)日：2021-04-22

申请号：US16660713

申请日：2019-10-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Chi-Chen CHIEN ,  Yuh-Harng CHIEN ,  Steven Alfred KUMMERL ,  Bo-Hsun PAN ,  Fu-Hua YU

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/522

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.

公开(公告)号：US20230395472A1

公开(公告)日：2023-12-07

申请号：US18453999

申请日：2023-08-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/565 ,  H01L21/4821 ,  H01L23/49503 ,  H01L23/3107

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to th first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

公开(公告)号：US20190355652A1

公开(公告)日：2019-11-21

申请号：US16206640

申请日：2018-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Bo-Hsun PAN ,  Yuh-Harng CHIEN ,  Fu-Hua YU ,  Steven Alfred KUMMERL ,  Jie CHEN ,  Rajen M. MURUGAN

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.