公开(公告)号：US20190206769A1

公开(公告)日：2019-07-04

申请号：US15856346

申请日：2017-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L25/065

CPC classification number: H01L23/49544 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/544 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/85122 ,  H01L2224/85201 ,  H01L2924/35 ,  H01L2924/37001 ,  H01L2924/386

Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

公开(公告)号：US20190186897A1

公开(公告)日：2019-06-20

申请号：US15848157

申请日：2017-12-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hung-Yu CHOU ,  Chien-Hao WANG ,  Tse-Tsun CHIU ,  Fu-Kang LEE ,  Liang-Kang SU

IPC: G01B11/06 ,  G01B11/16 ,  G01B11/28 ,  G01B11/30

CPC classification number: G01B11/0625 ,  G01B11/162 ,  G01B11/285 ,  G01B11/303 ,  G01N21/00

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

公开(公告)号：US20210375640A1

公开(公告)日：2021-12-02

申请号：US17401057

申请日：2021-08-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/62 ,  H01L23/00

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20190326131A1

公开(公告)日：2019-10-24

申请号：US16459184

申请日：2019-07-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20190206699A1

公开(公告)日：2019-07-04

申请号：US15857988

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng CHIEN ,  Hung-Yu CHOU ,  Fu-Kang LEE ,  Steven Alfred KUMMERL

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L23/49517 ,  H01L23/49548

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.