Abstract:
Thermal display including an air isolated integrated semiconductor circuit forming a semiconductor heater element array joined by a metallic connecting pattern which extends out over the heating elements to interconnect selected ones of them and a PN junction isolated integrated semiconductor drive matrix for the heating element array positioned in the same plane as the heating element array. The PN junction isolated integrated semiconductor drive matrix and the semiconductor heating element array are concurrently formed in the same semiconductor substrate and the heating element array is air isolated to provide a high degree of electrical and thermal isolation for the heating element array while both are located in the same plane on a larger support. The thermally sensitive material on which a dynamic display is formed or on which a permanent display is printed is in direct contact with the monocrystalline semiconductor material of the heating element array and can be passed over the heating element array and the drive matrix.
Abstract:
An information transfer system for transferring binary information from a first storage unit to a second storage unit in successive steps utilizing an intermediate storage unit and gates differently responsive to various conditions of an energizing source. During one condition of the energizing source, the binary information is transferred from the first storage unit to the intermediate storage unit, gates allowing communication between the first storage unit and the intermediate storage unit while blocking communication between the intermediate storage unit and the second storage unit. During another condition of the energizing source, the binary information is transferred from the intermediate storage unit to the second storage unit, gates allowing communication between the intermediate storage unit and the second storage unit while blocking communication between the intermediate storage unit and the first storage unit. The gates are differently responsive to two predetermined conditions of the energizing source in order to effect the desired communication and transfer of information between the storage units while these gates are non responsive to the energizing source when it is changing between these predetermined conditions so that the desired operation of the system is achieved only during two predetermined conditions of the energizing source.
Abstract:
Thermal display including an air isolated integrated semiconductor circuit forming a semiconductor heater element array joined by a metallic connecting pattern which extends out over the heating elements to interconnect selected ones of them and a PN junction isolated integrated semiconductor drive matrix for the heating element array positioned in the same plane as the heating element array. The PN junction isolated integrated semiconductor drive matrix and the semiconductor heating element array are concurrently formed in the same semiconductor substrate and the heating element element array is air isolated to provide a high degree of electrical and thermal isolation for the heating element array while both are located in the same plane on a larger support. The thermally sensitive material on which a dynamic display is formed or on which a permanent display is printed is in direct contact with the monocrystalline semiconductor material of the heating circuit array and can be passed over the heating element array and the drive matrix.