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    Moisture-curable adhesive tape and method for jacketing elongated items, especially leads
    1.
    发明申请
    Moisture-curable adhesive tape and method for jacketing elongated items, especially leads 审中-公开

    公开(公告)号：US20200255695A1

    公开(公告)日：2020-08-13

    申请号：US16785327

    申请日：2020-02-07

    申请人： TESA SE

    发明人： Kerstin KLINGEBERG ,  Heike SIMONIS ,  Lars GULBRANDSEN ,  Marco KUPSKY ,  Patrick KEREP

    IPC分类号： C09J7/21 ,  C09J7/38 ,  C09J175/12

    摘要： The present invention relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape must cure within the operational dictates for further processing, e.g. within 6 min, and after curing must exhibit the required dimensional stability properties. However, the adhesive compositions must not cure during storage itself, since otherwise they can no longer be used. Nor may the curing temperatures be too high, since otherwise the lead insulation, which is often made of PVC, may suffer damage. The invention proposes a method for jacketing an elongated item such as more particularly leads or cable sets, where a tape which comprises a moisture-curing binder on a carrier is first impregnated with water and immediately thereafter is guided in a helical line around the elongated item or the elongated item is wrapped in an axial direction by the adhesive tape, the elongated item together with the adhesive tape wrapping is brought into the desired disposition, more particularly into the cable set plan, the elongated item is held in this disposition, while the curable adhesive cures. Alternatively proposed is a method for jacketing an elongated item such as more particularly leads or cable sets, where a tape which comprises a moisture-curing binder on a carrier is guided in a helical line around the elongated item or the elongated item is wrapped in an axial direction by the adhesive tape, the elongated item together with the adhesive tape wrapping is brought into the desired disposition, more particularly into the cable set plan, the elongated item is held in this disposition, and the curable adhesive is brought to cure by the supply of moisture.

    PRIMER FOR ADHESIVE TAPES
    3.
    发明申请
    PRIMER FOR ADHESIVE TAPES 审中-公开

    公开(公告)号：US20170226382A1

    公开(公告)日：2017-08-10

    申请号：US15329300

    申请日：2015-08-27

    申请人： TESA SE

    发明人： Sebastian DIETZE ,  Kai ELLRINGMANN ,  Marco KUPSKY ,  Duc Hung NGUYEN ,  Uwe SCHÜMANN

    IPC分类号： C09J5/02 ,  B05D3/02

    摘要： Primer for adhesive tape with improved adhesion promoting properties, comprising a mixture G, which is dissolved or dispersed in one or more solvents, consisting of at least one copolymer obtained by copolymerization of a monomer mixture comprising an amount of at least 90 wt % of the following monomers: vinylcaprolactam and/or vinylpyrrolidone; one or more of the monomers a) and/or b): a) acrylic acid ester of a linear, primary alcohol having 2 to 10 carbon atoms in the alkyl group of the alcohol, b) acrylic acid ester of a branched, non-cyclic alcohol having 3 to 12 carbon atoms in the alkyl group, at least one chlorinated polyolefin, and at least one metal compound selected from the group consisting of metal acetylacetonates, metal alkoxides and alkoxy-metal acetylacetonates.

    WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE
    4.
    发明申请
    WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE 审中-公开

    公开(公告)号：US20200377766A1

    公开(公告)日：2020-12-03

    申请号：US16998508

    申请日：2020-08-20

    申请人： TESA SE

    发明人： Thilo DOLLASE ,  Jessika GARGIULO ,  Marco KUPSKY ,  Bastian WEDEL

    IPC分类号： C09J7/38 ,  C08F220/32 ,  C09J133/06 ,  C08L33/06 ,  C09J7/22 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

    摘要： Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

    CURABLE ADHESIVE COMPOUND AND REACTIVE ADHESIVE TAPES BASED THEREON
    6.
    发明申请
    CURABLE ADHESIVE COMPOUND AND REACTIVE ADHESIVE TAPES BASED THEREON 审中-公开

    公开(公告)号：US20200181390A1

    公开(公告)日：2020-06-11

    申请号：US16316283

    申请日：2017-06-15

    申请人： TESA SE

    发明人： Markus BRODBECK ,  Alexander FISCHER ,  Marco KUPSKY

    IPC分类号： C08L63/00 ,  C08L75/04 ,  C09J163/00 ,  C09J175/04

    摘要： The invention relates to a dispersion comprising one or more protic solvents as dispersion medium and also, as base components dispersed therein, one or more matrix polymers, one or more epoxides, at least one kind of a modified compound of the polyamine adduct type which is insoluble in the epoxides, where the at least one modified polyamine adduct is in dispersion in particulate form, with 90% of the particles having a particle size in the range from 0.1 to 10 μm as determined by laser diffractometry.

    Water Vapor-Blocking Adhesive Compound Having Highly Functionalized Poly(meth)acrylate
    7.
    发明申请
    Water Vapor-Blocking Adhesive Compound Having Highly Functionalized Poly(meth)acrylate 审中-公开

    公开(公告)号：US20190169470A1

    公开(公告)日：2019-06-06

    申请号：US16097779

    申请日：2017-03-15

    申请人： TESA SE

    发明人： Thilo DOLLASE ,  Jessika GARGIULO ,  Marco KUPSKY ,  Bastian WEDEL

    IPC分类号： C09J7/38 ,  C08F220/32 ,  C09J7/22 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

    摘要： The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components.

    LATENTLY REACTIVE ADHESIVE FILM
    8.
    发明申请
    LATENTLY REACTIVE ADHESIVE FILM 有权

    公开(公告)号：US20220025221A1

    公开(公告)日：2022-01-27

    申请号：US17281751

    申请日：2019-09-20

    申请人： TESA SE

    发明人： Marco KUPSKY

    IPC分类号： C09J7/35 ,  C09J7/10 ,  C09J5/06

    摘要： The invention relates to a thermally curable adhesive film comprising at least one layer of an adhesive comprising at least one epoxy-functionalized (co)polymer (A) having a weight-average molar mass in the range from 5000 g/mol to 5 000 000 g/mol and/or at least one epoxy-containing compound (B) different from the (co)polymer (A); at least one free-radical former (C); and at least one photoacid former (D). The invention further relates to a bond comprising two substrates that are bonded by the adhesive film or the adhesive of the present invention, and to a method of joining two substrates using the adhesive film or the adhesive of the present invention.