公开(公告)号：US20230256551A1

公开(公告)日：2023-08-17

申请号：US18111228

申请日：2023-02-17

申请人： TES Co., Ltd

发明人： Sang-Jean JEON ,  Hyun-Sang HWANG

IPC分类号： B23Q3/154 ,  H01J37/32

CPC分类号： B23Q3/154 ,  H01J37/32715 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32697 ,  H01J2237/332

摘要： There is provided a substrate support device. The substrate support device includes a substrate support part on which a wafer is deposited, the substrate support part including a first mesh electrode and a second mesh electrode disposed under the first mesh electrode; a chucking circuit configured to apply a DC voltage to the first mesh electrode; and an edge control circuit configured to control timings of operations related to the first mesh electrode and the second mesh electrode and control RF (Radio Frequency). The second mesh electrode is divided into a plurality of second sub-mesh electrode to remove an induced electromotive force generated due to a closed loop.