公开(公告)号：US11869861B2

公开(公告)日：2024-01-09

申请号：US17571780

申请日：2022-01-10

Applicant: Tencent Technology (Shenzhen) Company Limited

Inventor： Wenlong Zhang ,  Chuhong Yang ,  Yarui Zheng ,  Shengyu Zhang

IPC: G03F7/09 ,  G03F7/095 ,  G03F7/20 ,  H01L23/00

CPC classification number: H01L24/11 ,  H01L24/13 ,  G03F7/094 ,  G03F7/095 ,  G03F7/20 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/13109

Abstract: This disclosure discloses a method for preparing an indium pillar, a chip substrate and a chip. The method includes: applying a first photoresist layer on a substrate; applying a second photoresist layer on the first photoresist layer; covering a part of a surface of the second photoresist layer; underexposing the part of the second photoresist layer to obtain a processed second photoresist layer; developing and fixing the processed second photoresist layer to form an undercut structure; etching the first photoresist layer through the undercut structure to form an expose area; and depositing an indium material on the exposed area to form an indium pillar solder.

公开(公告)号：US11996319B2

公开(公告)日：2024-05-28

申请号：US17505294

申请日：2021-10-19

Applicant: Tencent Technology (Shenzhen) Company Limited

Inventor： Wenlong Zhang ,  Chuhong Yang ,  Shengyu Zhang

IPC: H01L21/764 ,  H01L23/66 ,  H01L29/06

CPC classification number: H01L21/764 ,  H01L23/66 ,  H01L29/0649 ,  H01L2223/66

Abstract: A method for manufacturing an air bridge, an air bridge, and an electronic device are disclosed. The method for manufacturing an air bridge includes: applying a first photoresist layer to a substrate; applying a second photoresist layer to the first photoresist layer; exposing, developing, and fixing the second photoresist layer, to form a patterned structure; etching away the first photoresist layer in a specified area through the patterned structure, to form a structure for blocking a deposition material from diffusing to a periphery on the substrate, the specified area including a projection area formed on the first photoresist layer by a top opening of the patterned structure; and depositing a bridge support structure on a surface of the substrate exposed after the first photoresist layer in the specified area is etched away, and forming an air bridge based on the bridge support structure.

公开(公告)号：US12190202B2

公开(公告)日：2025-01-07

申请号：US17540474

申请日：2021-12-02

Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED

Inventor： Sainan Huai ,  Yu Zhou ,  Zhenxing Zhang ,  Yarui Zheng ,  Wenlong Zhang ,  Chuhong Yang ,  Maochun Dai ,  Yicong Zheng ,  Shengyu Zhang

IPC: G06N10/00

Abstract: This application discloses methods and devices for a quantum chip, a quantum processor and a quantum computer, and relates to the field of quantum technology. The quantum chip includes a bottom sheet and a top sheet; a qubit array disposed on the top sheet, the qubit array comprising a plurality of qubits distributed in an array structure of M rows by N columns, and M and N being both integers greater than 1; a reading cavity disposed on the bottom sheet, and the reading cavity being configured to acquire status information of a qubit in the qubit array; and the bottom sheet and the top sheet being electrically connected.