公开(公告)号：US11670437B2

公开(公告)日：2023-06-06

申请号：US17574261

申请日：2022-01-12

申请人： TE CONNECTIVITY SERVICES GMBH

发明人： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC分类号： H01B7/285 ,  H02G15/013 ,  H01B13/00 ,  H01B3/30 ,  H01B3/44

CPC分类号： H01B13/0016 ,  H01B3/305 ,  H01B3/441 ,  H01B3/446 ,  H01B13/0036 ,  H01B7/285 ,  H01B13/0013 ,  H02G15/013

摘要： A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.

公开(公告)号：US11843232B2

公开(公告)日：2023-12-12

申请号：US17556065

申请日：2021-12-20

申请人： TE CONNECTIVITY SERVICES GMBH

发明人： Vijay Daga ,  Jaydip Das ,  Kavitha Bharadwaj ,  Ting Gao ,  Quentin Francis Polosky ,  Henry Paul S. Cervantes

IPC分类号： H02G3/04 ,  B60R16/02 ,  H01B7/285 ,  H02G15/013 ,  H01B7/28 ,  H01B7/00 ,  B29C35/02 ,  B29C35/08 ,  B29C63/00 ,  B29C63/06 ,  H01B13/00 ,  B29D99/00 ,  B29K105/00 ,  B29L31/34

CPC分类号： H02G3/0418 ,  B29C35/02 ,  B29C35/0805 ,  B29C63/0065 ,  B29C63/06 ,  B60R16/0215 ,  H01B7/0045 ,  H01B7/28 ,  H01B7/285 ,  H01B13/0036 ,  H02G15/013 ,  B29C2035/0811 ,  B29C2035/0822 ,  B29D99/0053 ,  B29K2105/256 ,  B29L2031/3462

摘要： A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.

公开(公告)号：US11677171B2

公开(公告)日：2023-06-13

申请号：US16842934

申请日：2020-04-08

申请人： TE Connectivity Services GmbH

发明人： Sunny Sethi ,  Vijay Daga

IPC分类号： H01R4/72 ,  B29C65/48 ,  H01R43/00 ,  H02G15/04

CPC分类号： H01R4/72 ,  B29C65/4815 ,  H01R43/00 ,  H02G15/04

摘要： A sealing device and method for sealing an electrical terminal. The sealing device includes a heat shrinkable tubing having an inner wall. A first sealant/adhesive is configured to cooperate with the heat shrinkable tubing. The first sealant/adhesive has a first sealant/adhesive first surface and an oppositely facing first sealant/adhesive second surface. The second surface of the first sealant/adhesive is bonded to the inner wall of the heat shrinkable tubing. A second sealant/adhesive is configured to cooperate with free ends of electrical conductors which are in electrical engagement with the electrical terminal. The second sealant/adhesive has a second sealant/adhesive first surface and an oppositely facing second sealant/adhesive second surface. The second sealant/adhesive first surface is provided in engagement with the electrical conductors. The second sealant/adhesive second surface is provided in engagement and bonded with the first sealant/adhesive first surface.