DIELECTRIC FILM AND ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20200312557A1

    公开(公告)日:2020-10-01

    申请号:US16829137

    申请日:2020-03-25

    Abstract: A dielectric film comprises a complex oxide represented by a general formula xAO-yBO-zC2O5 as a main component, wherein A is at least one selected from barium, calcium and strontium, B is at least one selected from magnesium and zinc, C is at least one selected from niobium and tantalum, x, y and z satisfy relations: x+y+z=1.000, 0.375, 0.563, 0.250, 0.500, and x/3, (x/3)+ 1/9, and in an X-ray diffraction chart of the dielectric film, a diffraction peak intensity of a (211) plane of the complex oxide or a diffraction peak intensity of a (222) plane of the complex oxide is larger than a diffraction peak intensity of a (110) plane of the complex oxide.

    DIELECTRIC FILM AND ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20200312558A1

    公开(公告)日:2020-10-01

    申请号:US16830884

    申请日:2020-03-26

    Abstract: A dielectric film comprises a complex oxide represented by a general formula xAO-yBO-zC2O5 as a main component, wherein A is at least one selected from barium, calcium and strontium, B is at least one selected from magnesium and zinc, C is at least one selected from niobium and tantalum, x, y and z satisfy relations: x+y+z=1.000, 0.375≤x≤0.563, 0.250≤y≤0.500, and x/3≤z≤(x/3)+1/9, and a full width at half maximum of a diffraction peak of a (110) plane of the complex oxide is 0.40° or more in an X-ray diffraction chart of the dielectric film.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20230371175A1

    公开(公告)日:2023-11-16

    申请号:US18044869

    申请日:2021-09-13

    CPC classification number: H05K1/0298 H05K1/05 H05K2201/0338 H05K2201/09409

    Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

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