公开(公告)号：US20230371175A1

公开(公告)日：2023-11-16

申请号：US18044869

申请日：2021-09-13

Applicant: TDK Corporation

Inventor： Yu FUKAE ,  Tomoya HANAI ,  Yusuke OBA ,  Kenichi YOSHIDA ,  Katsuharu YASUDA ,  Takashi OHTSUKA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K2201/0338 ,  H05K2201/09409

Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

公开(公告)号：US20210305231A1

公开(公告)日：2021-09-30

申请号：US17206656

申请日：2021-03-19

Applicant: TDK CORPORATION

Inventor： Yusuke OBA ,  Kenichi YOSHIDA ,  Takashi OHTSUKA ,  Yuichiro OKUYAMA ,  Tomoya HANAI ,  Yu FUKAE

IPC: H01L27/01 ,  H01L21/78 ,  H01L21/70

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.