公开(公告)号：US10527683B2

公开(公告)日：2020-01-07

申请号：US15921969

申请日：2018-03-15

Applicant: TDK Corporation

Inventor： Kunihiro Ueda ,  Koichi Otani ,  Hiraku Hirabayashi ,  Shuhei Miyazaki

IPC: G01R33/00 ,  G01R33/09 ,  G01R33/07 ,  G01R33/12

Abstract: A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.

公开(公告)号：US20180275204A1

公开(公告)日：2018-09-27

申请号：US15921969

申请日：2018-03-15

Applicant: TDK Corporation

Inventor： Kunihiro Ueda ,  Koichi Otani ,  Hiraku Hirabayashi ,  Shuhei Miyazaki

IPC: G01R33/00 ,  G01R33/09 ,  G01R33/12 ,  G01R33/07

CPC classification number: G01R33/0047 ,  G01R33/0005 ,  G01R33/07 ,  G01R33/09 ,  G01R33/1276 ,  H01L2224/48247

Abstract: A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.

公开(公告)号：US09824700B1

公开(公告)日：2017-11-21

申请号：US15161999

申请日：2016-05-23

Applicant: TDK CORPORATION

Inventor： Hiroki Aritomo ,  Atsushi Yamaguchi ,  Michitaka Nishiyama ,  Yumiko Yokoyama ,  Koichi Otani

IPC: H01L21/302 ,  H01L21/461 ,  H01G4/00 ,  H01G5/00 ,  H01G7/00 ,  H01G9/00 ,  H01G13/00 ,  H01B13/00 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  G11B5/127 ,  G11B5/11 ,  G11B5/39 ,  H01L21/027 ,  H01L45/00

CPC classification number: G11B5/1272 ,  G11B5/112 ,  G11B5/1278 ,  G11B5/3912 ,  H01L21/027 ,  H01L45/1675 ,  H01L45/1683 ,  H01L45/1691

Abstract: A manufacturing method for a magnetic head forms a leading shield having a top surface. The top surface of the leading shield includes first and second portions. The second portion is located farther from a medium facing surface than is the first portion, and recessed from the first portion. A first gap layer is then formed on the first portion. Then, a magnetic layer including an initial first side shield, an initial second side shield and a coupling section connecting them is formed using a mold. The mold is then removed. The coupling section is then removed by etching the magnetic layer. A second gap layer and a main pole are then formed in this order.