公开(公告)号：US12057301B2

公开(公告)日：2024-08-06

申请号：US18302215

申请日：2023-04-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wun-Kai Tsai ,  Wen-Che Liang ,  Chao-Keng Li ,  Zheng-Jie Xu ,  Chih-Kuo Chang ,  Sing-Tsung Li ,  Feng-Kuang Wu ,  Hsu-Shui Liu

IPC分类号： H01J37/32 ,  C23C16/505 ,  G05B19/4065 ,  H01J37/244 ,  H01L21/66 ,  H01L21/67

CPC分类号： H01J37/32926 ,  C23C16/505 ,  G05B19/4065 ,  H01J37/244 ,  H01J37/32183 ,  H01L21/67069 ,  H01L21/67253 ,  H01L22/20 ,  G05B2219/45031 ,  H01J2237/3321 ,  H01J2237/334

摘要： A fabrication system for fabricating IC is provided. A processing tool includes at least one electrode and a RF sensor. The electrode is configured to receive a radio frequency (RF) signal from an RF signal generator during first and second semiconductor manufacturing processes. The RF sensor wirelessly detects intensity of the RF signal. A computation device extracts statistical characteristics with a sampling rate based on the detected intensity of the RF signal. A fault detection and classification (FDC) system includes a processor. The processor is configured to determine whether or not the detected intensity of the RF signal exceeds a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the processor notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

公开(公告)号：US11685055B2

公开(公告)日：2023-06-27

申请号：US17002497

申请日：2020-08-25

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Chien-Fa Lee ,  Feng-Kuang Wu ,  Fu-Cheng Hung ,  Chi-Wei Chen ,  Chih-Hua Chen

IPC分类号： B25J11/00 ,  B65B69/00 ,  H01L21/673 ,  B25J15/00

CPC分类号： B25J11/0095 ,  B25J15/0014 ,  B25J15/0028 ,  B25J15/0052 ,  B65B69/00 ,  H01L21/67379

摘要： A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.

公开(公告)号：US12017342B2

公开(公告)日：2024-06-25

申请号：US18316853

申请日：2023-05-12

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Chien-Fa Lee ,  Feng-Kuang Wu ,  Fu-Cheng Hung ,  Chi-Wei Chen ,  Chih-Hua Chen

IPC分类号： B25J11/00 ,  B25J15/00 ,  B65B69/00 ,  H01L21/673

CPC分类号： B25J11/0095 ,  B25J15/0014 ,  B25J15/0028 ,  B25J15/0052 ,  B65B69/00 ,  H01L21/67379

摘要： A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.