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公开(公告)号:US20240268107A1
公开(公告)日:2024-08-08
申请号:US18165296
申请日:2023-02-06
发明人: Meng-Sheng CHANG , Yao-Jen YANG , Shao-Tung PENG , Chung-I HUANG
IPC分类号: H10B20/25
CPC分类号: H10B20/25
摘要: An integrated circuit includes a first active region, a second active region, a first fuse and a dummy fuse. The first active region extends in a first direction, and is on a first level. The second active region extends in the first direction, is on the first level, and is separated from the first active region in a second direction different from the first direction. The first fuse extends in the first direction, is on a second level, overlaps the first active region and is electrically coupled to the first active region. The dummy fuse extends in the first direction, is on the second level, and is separated from the first fuse in the second direction. The dummy fuse overlaps the second active region, and is not electrically coupled to the second active region.
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公开(公告)号:US20240049459A1
公开(公告)日:2024-02-08
申请号:US18448022
申请日:2023-08-10
发明人: Meng-Sheng CHANG , Yao-Jen YANG
IPC分类号: H10B20/20 , H01L23/525
CPC分类号: H10B20/20 , H01L23/5252
摘要: A metal fuse structure may be provided. The metal fuse structure may comprise a first fuse element and a second fuse element. The second fuse element may be adjacent to the first fuse element for a length L. The second fuse element may be spaced apart from first fuse element by a width W.
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公开(公告)号:US20230215804A1
公开(公告)日:2023-07-06
申请号:US18182760
申请日:2023-03-13
发明人: Meng-Sheng CHANG , Shao-Yu CHOU , Po-Hsiang HUANG , An-Jiao FU , Chih-Hao CHEN
IPC分类号: H01L23/525 , G06F30/39
CPC分类号: H01L23/5256 , G06F30/39 , G06F2119/18
摘要: A method of making a semiconductor device includes electrically connecting a component to a first side of a first fuse, wherein the first fuse is a first distance from the component. The method further includes electrically connecting the component to a first side of a second fuse, wherein the second fuse is a second distance from the component, and the second distance is different than the first distance. The method further includes electrically connecting a second side of the second fuse to a dummy vertical interconnect segment.
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公开(公告)号:US20220384339A1
公开(公告)日:2022-12-01
申请号:US17885321
申请日:2022-08-10
发明人: Shao-Ting WU , Meng-Sheng CHANG , Shao-Yu CHOU , Chung-I HUANG
IPC分类号: H01L23/525 , H01L27/112
摘要: A method (fabricating a fusible structure) includes forming a metal line that extends in a first direction, the forming a metal line including: configuring the mask such that the metal line has a first portion that is between a second portion and a third portion; and using an optical proximity correction technique with a mask so that the first portion has a first thickness that is thinner than a second thickness of each of the second portion and the third portion; and forming a first dummy structure proximal to the metal line and aligned with the first portion relative to the first direction.
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公开(公告)号:US20210082812A1
公开(公告)日:2021-03-18
申请号:US16573761
申请日:2019-09-17
发明人: Meng-Sheng CHANG , Shao-Yu CHOU , Po-Hsiang HUANG , An-Jiao FU , Chih-Hao CHEN
IPC分类号: H01L23/525 , H01L21/768 , H01L23/00
摘要: A semiconductor device includes a component having a functionality. The semiconductor device further includes an interconnect structure electrically connected to the component. The interconnect structure is configured to electrically connect the component to a signal. The interconnect structure includes a first column of conductive elements and a second column of conductive elements. The interconnect structure further includes a first fuse on a first conductive level a first distance from the component, wherein the first fuse electrically connects the first column of conductive elements to the second column of conductive elements. The interconnect structure further includes a second fuse on a second conductive level a second distance from the component, wherein the second fuse electrically connects the first column of conductive elements to the second column of conductive elements, and the second distance is different from the first distance.
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公开(公告)号:US20200058660A1
公开(公告)日:2020-02-20
申请号:US16533359
申请日:2019-08-06
发明人: Meng-Sheng CHANG , Yao-Jen YANG
IPC分类号: H01L27/112 , H01L23/528 , H01L23/525 , G11C17/18 , G06F17/50 , G11C17/16
摘要: A structure includes a word line, a bit line, and an anti-fuse cell. The anti-fuse cell includes a reading device, a programming device, and a dummy device. The reading device includes a first gate coupled to the first word line, a first source/drain region coupled to the bit line, and a second source/drain region. The first source/drain region and the second source/drain region are on opposite sides of the first gate. The programming device includes a second gate, a third source/drain region coupled to the second source/drain region, and a fourth source/drain region. The third source/drain region and the fourth source/drain region are on opposite sides of the second gate. The dummy device includes a third gate, a fifth source/drain region coupled to the fourth source/drain region, and a sixth source/drain region. The fifth source/drain region and the sixth source/drain region are on opposite sides of the third gate.
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公开(公告)号:US20230354591A1
公开(公告)日:2023-11-02
申请号:US18346700
申请日:2023-07-03
发明人: Meng-Sheng CHANG , Chien-Ying CHEN , Chia-En HUANG , Yih WANG
IPC分类号: H10B20/20 , G06F30/392 , H01L23/522 , H01L23/528
CPC分类号: H10B20/20 , G06F30/392 , H01L23/5226 , H01L23/528
摘要: A method of generating an IC layout diagram includes abutting first and second cells to define a first active region including first and second anti-fuse bits, abutting third and fourth cells to define a second active region including third and fourth anti-fuse bits, and defining a third active region including fifth and sixth anti-fuse bits adjacent to the first through fourth anti-fuse bits. The first cell includes first and second via regions overlapping first and second gate regions shared by respective structures and transistors of the first, third, and fifth anti-fuse bits, the fourth cell includes third and fourth via regions overlapping third and fourth gate regions shared by respective transistors and structures of the second, fourth, and sixth anti-fuse bits, the third cell includes fifth and sixth via regions overlapping the first gate region, and the second cell includes seventh and eighth via regions overlapping the fourth gate region.
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公开(公告)号:US20220285375A1
公开(公告)日:2022-09-08
申请号:US17193594
申请日:2021-03-05
发明人: Geng-Cing LIN , Ze-Sian LU , Meng-Sheng CHANG , Chia-En HUANG , Jung-Ping YANG , Yen-Huei CHEN
IPC分类号: H01L27/112 , H01L23/528 , H01L21/265
摘要: An integrated circuit read only memory (ROM) structure includes a first ROM transistor with a first gate electrode, a first source, and a first drain, and a second ROM transistor with a second gate electrode, a second source, and a second drain. A drain conductive line is over the first drain and the second drain, and is between the first drain and the second drain. The first drain, the drain conductive line and the second drain are between the first gate electrode and the second gate electrode, and a first trench isolation structure electrically isolates the first drain from the first source is below the first gate electrode.
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公开(公告)号:US20220237358A1
公开(公告)日:2022-07-28
申请号:US17342295
申请日:2021-06-08
发明人: Yao-Jen YANG , Meng-Sheng CHANG
IPC分类号: G06F30/392 , H01L27/02 , H01L27/118 , H01L27/12
摘要: A method includes receiving a design rule deck including a predetermined set of widths and spacings associated with active regions. The method also includes providing a cell library including cells having respective active regions, wherein widths and spacings of the active regions are selected from the predetermined set of the design rule deck. The method includes placing a first cell and a second cell from the cell library in a design layout. The first cell has a cell height in a first direction, and a first active region having a first width in the first direction. The second cell has the cell height, and a second active region having a second width in the first direction. The second width is different from the first width. The method further includes manufacturing a semiconductor device according to the design layout.
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公开(公告)号:US20220157718A1
公开(公告)日:2022-05-19
申请号:US17587716
申请日:2022-01-28
发明人: Meng-Sheng CHANG , Shao-Yu CHOU , Po-Hsiang HUANG , An-Jiao FU , Chih-Hao CHEN
IPC分类号: H01L23/525 , H01L23/00 , H01L21/768
摘要: A method of making a semiconductor device includes operations directed toward electrically connecting a component to a first fuse, wherein the first fuse is on a first conductive level a first distance from the component; identifying a conductive element for omission between the first fuse and a second fuse; and electrically connecting the component to the second fuse, wherein the second fuse is on a second conductive level a second distance from the component, the second distance is greater than the first distance, and the electrically connecting the component to the second fuse comprises electrically connecting the component to the second fuse without forming the identified conductive element.
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